Integrated Circuit Failure Analysis Method Flow

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Integrated Circuit Failure Analysis Method Flow [Copy link]

Integrated Circuit Failure Analysis Method Flow

Commonly used chip analysis methods:

1. X-Ray non-destructive detection can be used for detection

Various defects in IC packaging such as layer peeling, cracking, voids and wire integrity

Possible defects in the PCB manufacturing process such as poor alignment or bridging

Open circuit, short circuit or abnormal connection defects

Solder ball integrity in packages

2. SAT ultrasonic flaw detector/scanning ultrasonic microscope

It can perform non-destructive testing on the internal structure of IC packages, effectively detecting various damages caused by moisture or heat such as:

Wafer surface delamination

Cracks in solder balls, wafers or fillets

Pores inside packaging materials

Various holes such as holes on wafer bonding surface, solder balls, fillings, etc.

3. SEM scanning electron microscope/EDX energy dispersive X-ray instrument

Can be used for material structure analysis /defect observation, conventional micro-area analysis of element composition, and accurate measurement of component dimensions

4. Three commonly used leakage current path analysis methods: EMMI micro-light microscope/OBIRCH laser beam induced impedance value change test/LC liquid crystal hot spot detection

EMMI micro-optical microscope is used to detect abnormalities caused by ESD, latch up, I/O leakage, junction defect, hot electrons, oxide current leakage, etc.

OBIRCH is often used for high impedance and low impedance analysis inside chips, and circuit leakage path analysis. The OBIRCH method can effectively locate defects in circuits, such as voids in lines, voids under through-holes, and high resistance areas at the bottom of through-holes. It can also effectively detect short circuits or leakage, and is a powerful supplement to luminescence microscopy technology.

LC can detect the specific location of chip failure caused by ESD and EOS stress damage.

5. Probe Station/Probing Test can be used to directly observe the internal signals of the IC

6. ESD/Latch-up electrostatic discharge/latch-up effectiveness test

7. FIB circuit modification

FIB focused ion beam can directly cut, connect or jumper metal wires. Compared with re-tapeout verification, using FIB tools to verify circuit design modifications first has very obvious advantages in terms of timeliness and cost.

The chip failure analysis laboratory is able to implement testing work in accordance with international, domestic and industry standards, carry out comprehensive testing work from the bottom chip to the actual product, from physical to logical, and provide chip pre-processing, side channel attack, light attack, invasive attack, environment, voltage glitch attack, electromagnetic injection, radiation injection, physical safety, logical safety, function, compatibility and multi-point laser injection and other security testing services. At the same time, it can carry out failure analysis testing services to simulate and reproduce the phenomenon of intelligent product failure and find out the cause of failure, mainly including point needle workstation ( Probe Station), reactive ion etching (RIE), micro leakage detection system (EMMI), X-Ray detection, defect cutting observation system (FIB system) and other testing tests. Achieve the evaluation and analysis of the quality of intelligent products and provide quality assurance for the chips, embedded software and applications of intelligent equipment products.

philips_lu

This is too professional. How many people have such conditions? The simplest way is to first conduct physical inspection (appearance, color, temperature, etc.), and then refer to the data sheet for electrical parameter inspection.