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Once a device breaks down, don't stay away from it, but treat it as a treasure.

Everyone who drives knows where is the best place to improve driving skills? Highways are not good, only downtown areas and bad road conditions can improve driving skills. Social development is a process of discovering and solving problems. Problems are not terrible, but the frequent occurrence of the same type of problems is very terrible.

Basic concepts of failure analysis

Definition: The process of diagnosing failed electronic components.

1. Failure analysis often requires electrical measurements and the use of advanced physical, metallurgical and chemical analysis methods.

2. The purpose of failure analysis is to determine the failure mode and failure mechanism, and propose corrective measures to prevent the recurrence of such failure mode and failure mechanism.

3. Failure mode refers to the observed failure phenomenon and failure form, such as open circuit, short circuit, parameter drift, functional failure, etc.

4. Failure mechanism refers to the physical and chemical process of failure, such as fatigue, corrosion and overstress.

General Procedure for Failure Analysis

1. Collect on-site data

2. Electrically test and determine the failure mode

3. Non-destructive inspection

4. Open the package

5. Mirror test

6. Power on and locate the failure

7. Conduct physical and chemical analysis on the failure site to determine the failure mechanism.

8. Conduct comprehensive analysis to determine the cause of failure and propose corrective measures.

1. Collect field data:

2. Electrically test and determine the failure mode

Electrical failures can be divided into connectivity failures, electrical parameter failures and functional failures.

Connectivity failures include open circuits, short circuits, and changes in resistance values. These types of failures are easy to test, and most field failures are caused by electrostatic discharge (ESD) and electrical overstress (EOS).

Electrical parameter failure requires more complex measurements, and its main manifestations include parameter values exceeding the specified range (out of tolerance) and parameter instability.

To confirm functional failure, a known stimulus signal needs to be input to the component and the output result needs to be measured. If the measured output state is the same as the expected state, the component functions normally, otherwise it is a failure. Functional testing is mainly used for integrated circuits.

The three types of failures have certain correlations, that is, one type of failure may cause other types of failures. The root causes of functional failures and electrical parameter failures can often be attributed to connectivity failures. In the absence of complex functional test equipment and test procedures, it is possible to use simple connectivity test and parameter test methods for electrical testing, and combined with the application of physical failure analysis technology, satisfactory failure analysis results can still be obtained.

3. Non-destructive inspection

X-Ray inspection is to use X-rays to see through components (multiple directions and angles are optional) without destroying the chip to detect the packaging conditions of components, such as bubbles, bonding line abnormalities, grain size, bracket direction, etc.

Applicable scenarios: Check whether there are any abnormalities in bonding, whether there are any defects in packaging, and confirm the size and layout of the die.

Advantages: short construction period, intuitive and easy to analyze

Disadvantages: Limited access to information

limitation:

1. For devices of the same batch, the internal shapes of devices from different packaging production lines are slightly different;

2. Internal circuit damage or defects are difficult to detect and must be obtained through functional testing and other tests.

Case Study:

X-Ray flaw detection -- bubbles, bonding lines

X-Ray authenticity identification - blank bullet (as can be seen in the picture, there is no grain)

“All show and no substance”

The following is the real thing

X-Ray is used for origin analysis (chips of the same brand and model in the figure below)

X-Ray is used for failure analysis (PCB flaw detection and analysis)

(The densely packed dots below are the solder beads of BGA. As we can see from the picture below, this chip is actually a secondary BGA package)

picture

4. Open the package

There are two methods of opening the package: mechanical method and chemical method. According to the packaging material, the packaging types of microelectronic devices include glass packaging (diode), metal shell packaging, ceramic packaging, plastic packaging, etc.

Mechanical opening

Chemical opening

5. Microscopic imaging technology

Optical Microscopy Analysis Technique

Secondary Electron Imaging Technology in Scanning Electron Microscopy

Failure location technology based on voltage effect

6. Analysis of the main failure mechanisms of semiconductors

Electrical stress (EOD) damage

Electrostatic Discharge (ESD) Damage

Encapsulation failure

Wire bond failure

Poor die bonding

Metal-Semiconductor Contact Degradation

Sodium ion contamination failure

Oxide layer pinhole failure

annysky2012

I learned a lot, thanks for sharing.