MediaTek releases Dimensity 8300 mobile chip, comprehensive innovation to promote end-side generative AI innovation

MediaTek releases Dimensity 8300 mobile chip, comprehensive innovation to promote end-side generative AI innovation

November 21, 2023 – MediaTek released the Dimensity 8300 5G generative AI mobile chip, introducing Dimensity’s flagship experience to the Dimensity 8000 series, empowering high-end smartphone AI innovation. As a new member of the Dimensity 8000 series family, the Dimensity 8300 has advanced generative AI technology and high energy efficiency features, as well as an excellent gaming experience and high-speed and stable network connection capabilities.

Dr. Li Yanji, deputy general manager of MediaTek's Wireless Communications Division, said: "MediaTek's Dimensity 8000 series is committed to bringing the flagship experience to more users. The Dimensity 8300 has highly energy-efficient device-side AI capabilities, supports flagship-level storage, and provides Excellent gaming, imaging, multimedia entertainment experiences, and comprehensive platform innovation will open up more new opportunities for the high-end smartphone market.”

Dimensity 8300 adopts TSMC's second-generation  4nm  process and is based on Armv9 CPU architecture. The eight-core CPU includes 4 Cortex-A715 performance cores and 4 Cortex-A510 energy efficiency cores. The CPU peak performance is increased by 20% compared with the previous generation, and power consumption is saved by 30 %. % . In addition, the Dimensity 8300 is equipped with a 6-core GPU Mali-G615. The peak performance of the GPU is increased by 60% compared with the previous generation , and the power consumption is saved by 55% . Dimensity 8300 supports excellent memory and flash memory specifications, providing users with a silky and smooth experience in games, daily applications, imaging and other scenarios.

Dimensity 8300 is the first product in its class to support generative AI, supporting up to 10 billion parameter AI large language models. The chip integrates the MediaTek AI processor APU 780 and is equipped with a generative AI engine. The performance of integer operations and floating point operations is 2 times that of the previous generation. It supports Transformer operator acceleration and mixed precision INT4 quantization technology. The overall AI performance is 2 times that of the previous generation. 3.3 times, which can smoothly run innovative applications of terminal-side generative AI.

Dimensity 8300 is equipped with MediaTek's new generation "Star Speed ​​Engine". Through a unique performance algorithm, it can perform real-time resource scheduling based on the application's performance requirements and device temperature information, allowing users to enjoy high frame stabilization, low power consumption and long battery life. gaming experience. Starspeed Engine not only cooperates extensively with game applications, but will also expand ecological cooperation with more types of applications and upgrade users' APP experience.

MediaTek Dimensity 8300 features also include:

• Supports flagship LPDDR5X 8533Mbps memory, UFS 4.0 flash memory and multi-circular queue technology (Multi-Circular Queue, MCQ). The memory transfer rate is increased by 33% compared with the previous generation, and the flash memory read and write rate is increased by 100%.

• Equipped with a 14-bit HDR-ISP Imagiq 980 image processor, it improves the terminal's computational photography performance and upgrades the photo and video recording experience. Not only can users easily record clearer and sharper 4K60 HDR videos, they can also get longer battery life.

• Integrated 3GPP R16 5G modem provides a faster and more stable 5G network experience. Dimensity 8300 is optimized for specific scenarios to achieve smoother 5G connections in weak signal network environments. It also enhances the connection performance and range of Sub-6GHz networks, supports 3 carrier aggregation, and has a theoretical peak downlink rate of up to 5.17Gbps .

• Supports MediaTek 5G UltraSave 3.0+ power-saving technology, which can reduce 5G communication power consumption by up to 20% and ensure long-lasting 5G battery life.

• Wi-Fi 6E has enhanced performance and supports 160MHz bandwidth. Supporting Wi-Fi Bluetooth hyper-connection technology, the smartphone can simultaneously connect to Bluetooth headsets, wireless handles and other peripherals with lower latency.

• Supporting the Dimensity open architecture can bring a more personalized and differentiated user experience to terminal devices and unleash the powerful potential of the chip.

Smartphones powered by MediaTek Dimensity 8300 mobile chip are expected to be available by the end of 2023 .