Dalian Da Quanding Group launches hybrid active noise reduction TWS headset solution based on Qualcomm products

On April 13, 2023, Dalianda Holdings, a leading semiconductor component distributor committed to the Asia-Pacific market, announced that its subsidiary Quanding launched a hybrid active noise reduction TWS headset solution based on Qualcomm QCC3072 chip.

Figure 1 - Display board of Dalian Da Quanding’s hybrid active noise reduction TWS headset solution based on Qualcomm products

The continuous innovation of Bluetooth technology has promoted the explosion of the TWS headset market. As the number of users of TWS headsets increases year by year, consumers have also developed new demands for their functions. They not only need external features such as small size and comfortable wearing, but also need functions such as high sound quality and low power consumption. Features. Under this demand, Dalian Da Quanding launched a hybrid active noise reduction TWS headset solution based on Qualcomm QCC3072. This solution has functions such as Aptx, Sanmai CVC call noise reduction, third-generation ANC, LE Audio, etc., and can provide consumers with Provides a high-quality audio experience.

Figure 2 - Scenario application diagram of Dalianda Quanding’s hybrid active noise reduction TWS headset solution based on Qualcomm products

QCC3072 is a Qualcomm system-on-chip (SoC) for true wireless headphones. It supports Bluetooth v5.3 specification, LE Audio Broadcast Receiver (BMR), LE Audio Unicast Music Receiver (UMR) and stereo recording, and has low Features of low power consumption and small size. In the design of active noise reduction function, QCC3072 uses a hybrid ANC method, which combines feedforward and feedback noise cancellation technology. The feed-forward method involves using a microphone located on the outside of the earbud to pick up ambient noise and create a noise-cancelling signal to cancel out the noise. Feedback methods include using the microphone inside the headset to pick up residual noise and achieve further noise reduction.

Figure 3-Block diagram of Dalianda Quanding’s hybrid active noise reduction TWS headset solution based on Qualcomm products

Thanks to the performance of QCC3072, this solution has excellent active noise reduction function, which allows users to provide consistent high-quality audio effects even in challenging environments. Moreover, the long-term battery life of the solution also allows users to not worry about power shortages whether during long-distance travel or daily office work.

Core technical advantages:

　Bluetooth v5.3 specification, supports LE Audio;

✓Supports LE Audio Broadcast Receiver (BMR), LE Audio Unicast Music Receiver (UMR) and stereo recording;

✓Supports Qualcomm’s third-generation ANC (noise reduction depth up to -36db);

Support Google Fast Pair;

ΩSupports Google and Amazon voice assistants;

Support Aptx adaptive, Aptx Voice, aptX HD.

Plan specifications:

　Qualcomm TrueWireless stereo headphones;

Ÿ 180MHz Kalimba™ audio DSP;

　High - performance 24-bit audio interface;

Flexible PIO controller and LED pins with PWM support;

　Serial interface: UART, bit serializer (I2C/SPI), USB 2.0;

● Supports Qualcomm® Active Noise Cancellation (ANC) – feedforward, feedback and hybrid – and adaptive active noise cancellation;

　 aptX , aptX Adaptive and aptX HD, Snapdragon Sound audio;

Ultra -small profile 99-ball 4.930mm x 3.936mm x 0.57mm, 0.4mm pitch WLCSP;

Audio interface: 24bit I2S, 2x DAC (supports differential ClassAB and ClassD).