SK Hynix to supply industry's first HBM3 DRAM to Nvidia

Seoul, June 9, 2022 – SK Hynix Inc. (or “the Company”, www.skhynix.com) announced that it has begun mass production of HBM3, the industry’s best performance DRAM.

* HBM (High Bandwidth Memory): It is a high-value, high-performance memory composed of vertically stacked DRAM chips. Its data processing speed is much faster than traditional DRAM. HBM3 DRAM is the fourth generation of HBM products. The previous three generations are HBM (first generation), HBM2 (second generation), and HBM2E (third generation).

SK Hynix announced the successful development of the industry's first HBM3 DRAM in October last year, and announced the start of mass production seven months later, which is expected to further consolidate the company's leadership in the high-end DRAM market.

随着人工智能和大数据等尖端技术的加速发展，全球主要科技企业正在探索创新方法，以快速处理增速迅猛的数据量。相较于传统 DRAM，HBM 在数据处理速度和性能方面都具有显著优势，有望获得业界广泛关注并被越来越多地采用。

NVIDIA recently completed the performance evaluation of SK Hynix's HBM3 samples. SK Hynix will supply HBM3 to NVIDIA systems, which are expected to start shipping in the third quarter of this year. SK Hynix will also increase HBM3 production in the first half of this year in accordance with NVIDIA's plan.

The highly anticipated NVIDIA H100 is considered to be the largest and most powerful accelerator in the world. SK Hynix's HBM3 has a bandwidth of up to 819GB/s, which is expected to enhance the performance of accelerated computing. This bandwidth is equivalent to being able to transmit 163 Full-HD movies (each movie is about 5GB) per second.

SK Hynix President (Business Manager) Noh Jong-won said that the close cooperation with NVIDIA has enabled SK Hynix to gain first-class competitiveness in the high-end DRAM market. "Our goal is to become a solution provider that understands and solves customer needs through continuous, open collaboration.