Accelerate the training of scarce talents. Strengthen the mechanism of integrating industry and education, adhere to demand orientation, and cultivate high-level talents in close connection with the core technology research and development needs of integrated circuit and software enterprises. Support qualified colleges and universities to build national demonstration microelectronics colleges; include the integrated circuit and software industries in the key directions of the construction of provincial modern industrial colleges, and give preference to enrollment indicators, teaching staff, etc. Strengthen the construction of majors related to the integrated circuit and software industries in vocational colleges, deepen the integration of industry and education, and support enterprises to jointly cultivate technical experts in the fields of integrated circuit and software industries with vocational colleges and universities. Strengthen digital empowerment and support industrial talents to solve technical problems for enterprises through online platforms. For pilot enterprises included in the scope of construction and cultivation of industry-education integration enterprises, if the investment in establishing vocational education meets the requirements, the education surcharge and local education surcharge that the enterprise should pay in that year can be deducted at a rate of 30% of the investment amount. Encourage local governments to jointly build training carriers with local universities and leading enterprises to build an integrated talent training system of industry, academia and research.
Innovation platform and industrial platform policy
Build a high-level innovation platform system. Support leading integrated circuit and software companies, research institutes, universities, and their consortia to create R&D and industrialization platforms around high-end chips, special processes, wide bandgap semiconductors, core equipment materials, key software, and other fields. Those who meet the relevant conditions can apply for projects such as provincial engineering research centers, key enterprise research institutes, technology innovation centers, manufacturing innovation centers, industrial innovation centers, and provincial key industrial Internet platforms. After approval, they will enjoy relevant policy support according to regulations. Among them, those who are approved as provincial manufacturing innovation centers will receive a subsidy of 10 million yuan from the provincial finance, and those who are upgraded to national level will receive another 30 million yuan in rewards; units included in the provincial key industrial Internet platform construction will receive a subsidy of 5 million yuan.
Build an integrated public service platform. Improve the service capabilities of the Hangzhou National "Core Fire" Entrepreneurship and Innovation Base, make good use of the EDA public technology service platform and the integrated circuit design and testing service platform, and provide enterprises with integrated services such as technology development, wafer testing, equipment verification, and intellectual property rights. Further build the Zhejiang Integrated Circuit Innovation Center, build a public innovation platform for 12-inch CMOS integrated circuit chip design and manufacturing process technology, and form an independent, controllable, open, shared, and sustainable integrated circuit industry ecology. Support local governments, industrial parks, corporate communities, etc. to build integrated circuit and software public service platforms with common technology research and development, entrepreneurship cultivation, financial consulting, talent training and other functions.
Support the construction of industrial development platforms. Support the construction of provincial integrated circuit industrial bases in Hangzhou, Ningbo, Shaoxing, Jiaxing, Quzhou, etc., create a high-level core industrial cluster around Hangzhou Bay, and drive the development of supporting industrial zones such as semiconductor materials. Support the construction of a new batch of integrated circuit "10,000 mu and 100 billion" new industrial platforms, and give priority to the land space of new industrial platforms in the new round of national land space planning. Promote the construction of industrial carriers such as Hangzhou Qiantang Core Valley, Ningbo Core Port Town, and Shaoxing Integrated Circuit Town, and strengthen the service capabilities of the park. Support Hangzhou in building an international software city and Ningbo in creating a characteristic Chinese software city. Support the construction of a number of provincial software industrial parks with characteristic, professional, branded and high-end development, and strive to create Chinese software parks.
Enterprise cultivation policy
Cultivation of "chain leader" enterprises. Aiming at the integrated circuit industry and software industry, according to the "chain leader + chain leader" collaborative mechanism work plan, a number of "chain leader" enterprises will be identified to form a three-level contact and service mechanism for "chain leader" enterprises at the provincial, municipal and county levels. Major projects of "chain leader" enterprises to supplement and strengthen the chain will be given priority in the provincial major industrial projects, and will be guaranteed in terms of land, energy consumption, and environmental protection capacity factors. Explore giving per-mu evaluation credit enhancement guarantees to the provincial partner enterprises of "chain leader" enterprises. Increase the efforts to attract leading enterprises at home and abroad, and increase support in terms of land use, energy use, emissions, approval, funds, etc. on a "one-on-one" basis.
Support enterprises to become bigger and stronger. Support enterprises in the fields of integrated circuit high-end chips, special process manufacturing, key materials, core equipment and components, key software, etc. to apply for the "water-raising fish" action plan, single champions, hidden champions, specialized and new small giants, technology-based small and medium-sized enterprises, high-tech enterprises and other policies, and provide support according to regulations. For software and integrated circuit design companies whose R&D investment accounts for more than 10% of sales revenue and whose annual R&D investment exceeds 50 million, and integrated circuit manufacturing, packaging and testing, equipment, and materials companies whose R&D investment accounts for more than 5% of sales revenue and whose annual R&D investment exceeds 50 million, local governments should focus on cultivation and increase support.
Industrial chain and supply chain security policy
Ensure smooth flow of industrial chain and supply chain. Strengthen the linkage of inter-provincial industrial chain and supply chain, establish a provincial industrial chain and supply chain guarantee work mechanism, and give priority to guaranteeing the resumption of work and production and urgently needed materials of the leading enterprises and key core enterprises of the industrial chain on the premise of ensuring the strict implementation of epidemic prevention and control measures.
Explore ways to quickly clear customs for integrated circuit chips, key equipment, and raw materials. Improve the efficiency of epidemic prevention and control testing for integrated circuit products and shorten customs clearance time. Provide point-to-point assistance to the "chain leader" enterprises in the integrated circuit industry chain and the "white list" enterprises in the supply chain of the Ministry of Industry and Information Technology to smooth the supply chain of related commodities. Promote the construction of local electronic chemical testing laboratories, improve testing efficiency, facilitate enterprises in applying for dual-use items and technology import licenses, and reduce the customs clearance time, testing costs, and storage costs of raw materials of enterprises.
Previous article:Infineon: It is wise to manufacture chips in multiple locations
Next article:Speedcom Semiconductor completes A2 round of strategic financing of RMB 300 million to accelerate mass production of multiple Wi-Fi 6 chipsets
- Popular Resources
- Popular amplifiers
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Keysight Technologies Helps Samsung Electronics Successfully Validate FiRa® 2.0 Safe Distance Measurement Test Case
- Innovation is not limited to Meizhi, Welling will appear at the 2024 China Home Appliance Technology Conference
- Innovation is not limited to Meizhi, Welling will appear at the 2024 China Home Appliance Technology Conference
- Huawei's Strategic Department Director Gai Gang: The cumulative installed base of open source Euler operating system exceeds 10 million sets
- Download from the Internet--ARM Getting Started Notes
- Learn ARM development(22)
- Learn ARM development(21)
- Learn ARM development(20)
- Learn ARM development(19)
- Learn ARM development(14)
- Highly recommend a good introductory book on digital signal processing
- python3,snake
- [TI recommended course] #[High Precision Laboratory] Interface: 3 Ethernet#
- MSP430F5529 ADC Reference
- Fennel – Lisp syntax for Lua programming
- [LSM6DSOX finite state machine routine study 1]--Introduction to finite state machine and routine
- Reading the good book "Operational Amplifier Parameter Analysis and LTspice Application Simulation" Reading experience 01- Familiarity with the book
- What should be paid attention to in the vias in the PCB
- New wireless LED driver platform advances commercial lighting applications and meets future demands
- How were antennas invented?