HPC chip demand drives large-size ABF substrates to expand production

As chipmakers continue to expand production of large-size HPC chips, IC substrate manufacturers are stepping up efforts to expand production capacity for the large-area ABF substrates needed to process such chips, industry sources said.

According to Electronic Times, after completing the expansion, Xinxing Electronics is looking for new land to further expand its production capacity. Sources said that its local peers Nanya Circuit Board and Kinsus Technology are also increasing capital expenditures to support new capacity expansion plans in 2022. Japan's Ibiden and Shinko, as well as South Korea's Semco and LG Innotek are also busy deploying more ABF substrate production lines.

These manufacturers are expected to further increase capital investment in 2022, not only to increase production capacity but also to upgrade technology to better meet customer needs, the sources said, adding that for HPC chips with increasingly complex designs and increasing functions, ABF substrates with larger area sizes and higher number of layers are urgently needed.