Embracing new opportunities of heterogeneous integration, XPEC 2021 User Conference held

Corefree Semiconductor, a leading company in the domestic EDA and filter industry, recently successfully held its 2021 National User Conference in Shanghai. This conference, co-organized by the Shanghai Integrated Circuit Industry Association and the Shanghai Integrated Circuit Technology and Industry Promotion Center, brought together many partners in Corefree Semiconductor and its ecosystem: senior executives and experts from ZTE, Unisoc, Synopsys, Rohde & Schwarz, Microsoft Azure, ProLiant, etc., with the theme of "Embracing New Opportunities in Heterogeneous Integration", shared with more than 200 colleagues in the industry the status quo and trends of the semiconductor industry in the upstream and downstream links of the industry chain such as EDA, design, manufacturing, packaging and testing, and cloud platforms in the era of heterogeneous integration.

Leaders attending the conference included Fu Xinhua, deputy director of Shanghai Municipal Economic and Information Commission, Chen Ming, director of the High-tech Department of Shanghai Municipal Science and Technology Commission, and Dr. Xu Xin, director of the Shanghai Pudong New Area Science and Technology and Economic Commission.

The conference was opened by Fu Xinhua, deputy director of Shanghai Municipal Commission of Economy and Information Technology. He mentioned that Xinhe Semiconductor is an EDA enterprise that Shanghai has focused on, and its rapid development in the past year is commendable. He encouraged Xinhe to focus on specialization, excellence and innovation, take on the mission of revitalizing the semiconductor industry and EDA industry given by the times, and contribute to the construction of our Shanghai Science and Technology Innovation Center.

Xu Xiufa, Deputy Secretary-General of the Shanghai Integrated Circuit Industry Association, one of the co-organizers of the event, also encouraged Xinhe Semiconductor to continue its efforts in his speech, play a leading role in the domestic EDA industry, and help China's integrated circuit industry move forward.

 "The pandemic has accelerated the digital transformation of global industries, and the semiconductor industry's important contribution to this comes from HPC high-performance computing technology. Advanced processes, advanced packaging, and high-speed systems are the three major supports for the development of HPC." Dr. Ling Feng, founder and CEO of Xinhe Semiconductor, said, "Xinhe has formed a complete EDA product line driven by system analysis, covering chips, packaging, and systems, and supporting advanced processes and advanced packaging. It can provide powerful solutions for the major industries with the most urgent HPC applications, such as data centers, cloud computing, 5G communications, artificial intelligence, big data analysis, and smart cars."

Dr. Dai Wenliang, co-founder and senior vice president of CoreHub Semiconductor, released the Xpeedic EDA2021 version at the conference, providing a complete modeling, simulation, analysis and testing platform for electronic systems. This year's star is the industry's first unified platform for 3DIC advanced packaging design analysis released by CoreHub Semiconductor and Synopsys, which has built a fully integrated, high-performance and easy-to-use environment for customers, providing a full-process solution for 3DIC from development, design, verification, signal integrity simulation, power integrity simulation to final sign-off. In addition to EDA, Dr. Dai also focused on CoreHub's filter solution XFilter: Using IPD technology supplemented by SAW and BAW processes, CoreHub provides a diversified filter product portfolio that can meet the diverse needs for higher frequencies, larger bandwidths, and better insertion loss and out-of-band suppression performance, and uses the virtual IDM model to help RF module manufacturers achieve product innovation.

Yi Bi, deputy minister of ZTE Corporation, a world-leading communication system service provider, Liu Zhinong, senior vice president of Unigroup Spreadtrum, China's leading wireless communication terminal core chip supplier, and Xu Wei, deputy general manager of China region of Synopsys, the world's number one EDA solution provider, gave wonderful presentations on "Heterogeneous Integration", "3DIC", "Advanced Packaging" and "System Design" in the keynote speech session of the conference, and expressed great expectations for the full-process EDA platform for 3DIC advanced packaging design and analysis launched by Xinhe.

This user conference was divided into two technical sub-forums: "Analog RF System Design" and "High-Speed ​​System Design". Experts and partners of Xinhe Semiconductor shared a number of popular industry applications on site, including the "2.5D/3D heterogeneous integrated cross-scale joint simulation" solution; high-speed SerDes system simulation and optimization platform; high-speed analog circuit passive device design simulation platform; 5G RF front-end filter trend challenges and responses; high-speed parallel system (SI/PI) and measurement verification solutions; PDK development full-process solutions; 5G era RF system simulation and optimization platform; Xinhe cloud platform, a tool to improve simulation efficiency, etc.

Xinhe Semiconductor has been committed to the construction of the ecosystem. The company has maintained partnerships with the world's top six wafer fabs, the top five EDA manufacturers, and the world's top two cloud platform manufacturers, Amazon AWS and Microsoft Azure. Xinhe's vision is to work together with domestic IC design, wafer fabs, packaging and testing plants, and system manufacturers to jointly promote the development of China's integrated circuit industry.

About Xcell Semiconductor

Xinhe Semiconductor is a leading company in the domestic EDA industry, providing simulation EDA solutions for the entire industry chain covering IC, packaging to systems, and is committed to enabling and accelerating the design of a new generation of high-speed and high-frequency intelligent electronic products.

Xinhe Semiconductor's EDA products and solutions with independent intellectual property rights have been continuously verified in semiconductor advanced process nodes and advanced packaging, and have been widely used in 5G, smart phones, the Internet of Things, artificial intelligence, data centers and other fields, effectively connecting major IC design companies and manufacturing companies.

Xinhe Semiconductor also plays an important role in the global 5G RF front-end supply chain. It provides RF front-end filters and modules to mobile phone and IoT customers through its independent and innovative filter and system-level packaging design platform, and has been selected by Yole as the world's leading IPD filter supplier.

Xpeedic Semiconductor was founded in 2010 and was formerly known as Xpeedic Technology. Its operations and R&D headquarters are located in Zhangjiang, Shanghai, with R&D centers in Suzhou and Wuhan, and sales and technical support departments in Silicon Valley, Beijing, Shenzhen, Chengdu and Xi'an. For more information, please visit www.xpeedic.com.