A new patent shows that Samsung intends to equip its Galaxy Z Fold4 foldable phone with an under-screen fingerprint sensor that will be able to scan from both sides of the screen. The Z Fold3 was previously thought to be equipped with an under-screen fingerprint sensor, just like regular Samsung Galaxy smartphones. However, consumers were slightly disappointed when the Korean company decided to use a side-mounted scanner.
But if the above technology really comes with the Z Fold4, then Samsung will achieve under-screen fingerprint in a way that has never been attempted before.
The patent was submitted to the World Intellectual Property Office (WIPO) on March 31 this year. The patent is named "Foldable electronic device capable of detecting fingerprints through at least part of the screen" and was published on October 7, 2021.
The patent describes a fingerprint sensor positioned in such a way that it can be used both through the outer cover screen and through the inner foldable screen. This is achieved by mounting the sensor on the lower left half of the flexible screen. A small printed circuit board (PCB) is placed between the sensors, which in turn are connected to the main PCB. This opens up new possibilities for biometric authentication in both unfolded and folded positions.
Samsung claims in the patent that since foldable devices are equipped with flexible screens, wrinkles are more likely to appear when the screen is under pressure. Therefore, existing fingerprint technology should be adjusted to alleviate this limitation, and the implementation of dual-sided fingerprint sensors seems to be the perfect solution.
Previous article:Ledman Optoelectronics' Q3 net profit increased by 589.77% year-on-year, and its domestic Micro LED business grew rapidly
Next article:BOE begins to become iPhone 13's OLED panel supplier
Recommended ReadingLatest update time:2024-11-22 14:45
- Popular Resources
- Popular amplifiers
- iPhone SE 4 reportedly debuts with Apple's self-developed 5G baseband: coming in March next year
- iPhone 17 series revealed to be the first to use 3nm A19 series chips: no chance of TSMC's 2nm process
- The supply chain said that upstream components will be greatly reduced in price: Will domestic mobile phones take the initiative to reduce their prices after the current price increase?
- Apple to spend nearly $100 million to lift Indonesia's iPhone 16 sales ban
- Tata Motors acquires Pegatron's only iPhone factory in India, deepening cooperation with Apple
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- Intel promotes AI with multi-dimensional efforts in technology, application, and ecology
- ChinaJoy Qualcomm Snapdragon Theme Pavilion takes you to experience the new changes in digital entertainment in the 5G era
- Infineon's latest generation IGBT technology platform enables precise control of speed and position
- Two test methods for LED lighting life
- Don't Let Lightning Induced Surges Scare You
- Application of brushless motor controller ML4425/4426
- Easy identification of LED power supply quality
- World's first integrated photovoltaic solar system completed in Israel
- Sliding window mean filter for avr microcontroller AD conversion
- What does call mean in the detailed explanation of ABB robot programming instructions?
- USB Type-C® and USB Power Delivery: Designed for extended power range and battery-powered systems
- RAQ #223: How to measure and determine soft-start timing without a soft-start equation?
- RAQ #223: How to measure and determine soft-start timing without a soft-start equation?
- GigaDevice's full range of automotive-grade SPI NOR Flash GD25/55 wins ISO 26262 ASIL D functional safety certification
- GigaDevice's full range of automotive-grade SPI NOR Flash GD25/55 wins ISO 26262 ASIL D functional safety certification
- New IsoVu™ Isolated Current Probes: Bringing a New Dimension to Current Measurements
- New IsoVu™ Isolated Current Probes: Bringing a New Dimension to Current Measurements
- Infineon Technologies Launches ModusToolbox™ Motor Kit to Simplify Motor Control Development
- Infineon Technologies Launches ModusToolbox™ Motor Kit to Simplify Motor Control Development
- STMicroelectronics IO-Link Actuator Board Brings Turnkey Reference Design to Industrial Monitoring and Equipment Manufacturers
- Application of virtual technology in new product development1
- How TI dual-core processor ARM+DSP achieves collaborative work
- What does this statement about LDO mean?
- RISC-V developers say: IDE is not comfortable to use, but IAR already has a RISC version, but...
- Help: Some questions about Canaan K510 CRB-KIT development kit
- Adaptive TV Display of Digital Image Sequences
- Access Denied problem occurs in Ubuntu 20 window ssh connection
- USB download cable driver installation.pdf
- Live Review: How to use the domestic 800MHz RISC-V MCU Xianji HPM6750 to control four-axis servo motors
- MicroPython Hands-on (39) - Image Basics of Machine Vision