EEPROM, 8KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8
Parameter Name | Attribute value |
Maker | Rochester Electronics |
package instruction | SOP, |
Reach Compliance Code | unknown |
Other features | DATA RETENTION > 40 YEARS |
Data retention time - minimum | 40 |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e0 |
length | 4.9 mm |
memory density | 65536 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 8192 words |
character code | 8000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Maximum seat height | 1.75 mm |
Serial bus type | SPI |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 3.9 mm |
NM25C640LZM8 | NM25C640LZEM8 | |
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Description | EEPROM, 8KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8 | EEPROM, 8KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8 |
Maker | Rochester Electronics | Rochester Electronics |
package instruction | SOP, | SOP, |
Reach Compliance Code | unknown | unknown |
Other features | DATA RETENTION > 40 YEARS | DATA RETENTION > 40 YEARS |
Data retention time - minimum | 40 | 40 |
JESD-30 code | R-PDSO-G8 | R-PDSO-G8 |
JESD-609 code | e0 | e0 |
length | 4.9 mm | 4.9 mm |
memory density | 65536 bit | 65536 bit |
Memory IC Type | EEPROM | EEPROM |
memory width | 8 | 8 |
Number of functions | 1 | 1 |
Number of terminals | 8 | 8 |
word count | 8192 words | 8192 words |
character code | 8000 | 8000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 85 °C |
organize | 8KX8 | 8KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | SERIAL | SERIAL |
Maximum seat height | 1.75 mm | 1.75 mm |
Serial bus type | SPI | SPI |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL |
Terminal surface | TIN LEAD | TIN LEAD |
Terminal form | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL |
width | 3.9 mm | 3.9 mm |