Semiconductor packaging welding materials company Xianyi Electronics received Series A investment

Recently, Guangzhou Xianyi Electronic Technology Co., Ltd. (hereinafter referred to as "Xianyi Electronic"), a provider of semiconductor micro-assembly material solutions, received a round A investment from Guotou Venture Capital, which aims to promote domestic substitution of advanced semiconductor packaging materials.

Founded in 2008, Xianyi Electronics is an enterprise integrating R&D, production and sales of semiconductor advanced packaging micro-connection materials. The gold-tin solder independently developed by Xianyi Electronics and with independent intellectual property rights has reached the domestic leading and international advanced level, successfully achieved domestic substitution, broke the monopoly of foreign manufacturers, and solved the "bottleneck" problem of semiconductor micro-connection strategic materials.

It is reported that the packaging materials such as precision preformed solder sheets, pre-set gold-tin ceramic cover plates/shells, gold-tin thin film heat sinks, gold-tin solder pastes produced by Xianyi Electronics are widely used in aviation, military, microwave, optical communication, laser infrared, power electronics, automotive electronics, consumer electronics, 5G Internet of Things and other fields. They are mainly used for reliable packaging and connection of hybrid integrated circuits, semiconductor chips, filter components, microwave devices, IGBT high-power devices, connectors, sensors, optoelectronic devices and other special electronic components, as well as metal or ceramic shell hermetic packaging.

According to news from Xianyi Electronics, SDIC Venture Capital stated that Xianyi Electronics is a leading company in the field of domestic semiconductor packaging welding materials. The company focuses on the research and development of semiconductor packaging welding materials, breaking the long-term monopoly of foreign companies such as the United States and Japan. Many products have solved the "bottleneck" problem in my country's semiconductor packaging welding materials such as laser, radio frequency, and infrared, which has practical value and significance for achieving independent control of the national industrial chain. Xianyi Electronics has always focused on the research and development of welding materials for semiconductor micro-nano packaging, and has used this as its core competitiveness to expand and iterate its product pipeline, laying a solid foundation for the company's development.