On October 7th, local time on Wednesday, Samsung Electronics announced that the company's next-generation 3-nanometer chip manufacturing technology will be postponed to 2022, and said that the more advanced 2-nanometer chip manufacturing technology will be available in 2025.
Samsung had planned to start producing faster and more energy-efficient chips using the 3-nanometer process this year. The company said at the Samsung Foundry Forum on Wednesday that the transition to a new manufacturing technology is difficult and that 3-nanometer chips will be available in the first half of 2022. This means that Samsung's customers will not be able to use this cutting-edge technology until next year.
Samsung's chip foundry customers include mobile chip design company Qualcomm, server maker IBM and Samsung's own products.
However, the good news is that Samsung announced that it will achieve 2-nanometer chip manufacturing technology in the second half of 2025. Samsung said this will enable chips to continue to move forward in performance, energy efficiency and miniaturization of electronic products.
TSMC also announced in August this year that it would postpone the launch of 3-nanometer chip manufacturing technology. The delay of this plan has relieved the pressure on Intel. Intel is currently launching its own foundry business to regain market share taken away by TSMC and Samsung.
With the continuous growth of personal computer sales, the popularity of smartphones and the increasing volume of online services in data centers, the market demand for chips has exceeded production capacity. The global chip shortage has affected the sales of personal computers, game consoles, automobiles and other products that rely on the electronic product supply chain.
Shawn Han, senior vice president of Samsung's foundry business, said the chip shortage will not ease until 2022. He said, "Although we are investing and other foundries are also increasing capacity, we think this situation will continue for another six to nine months."
The process of switching to the next generation of chip manufacturing technology is very complicated. A single chip is made up of billions of transistors smaller than dust. Chip manufacturing factories need to etch circuit patterns on silicon wafers, a process that requires dozens of steps and takes months. Advances in chip manufacturing technology come from the continuous miniaturization of transistors, so that more transistors can be compressed on the chip, thereby increasing processing speed and reducing power consumption. Samsung's next-generation chip manufacturing technology 3GAE uses a technology called "all-around gate transistor" (GAA).
Samsung expects to launch more mature 3GAP chip products while achieving high production volumes by 2023. By 2025, Samsung plans to switch to 2GAP, a more advanced 2-nanometer chip manufacturing technology.
As chips become more complex, they typically become more expensive, which is why many customers insist on using chips produced using older, cheaper manufacturing processes from companies like GlobalFoundries. But Samsung believes it can reduce the cost of brand-new manufacturing technology. "Although GAA is a difficult technology, we will continue to work hard to reduce the cost of a single transistor," said Moonsoo Kang, head of Samsung Electronics' foundry strategy team. "This trend will continue."
Previous article:Kingston announces that two of its DDR5 memory products have been certified by Intel
Next article:The demand and importance of memory chips are becoming increasingly apparent
Recommended ReadingLatest update time:2024-11-15 13:51
- Popular Resources
- Popular amplifiers
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- How haptic technology can enhance driving safety
- Let’s talk about the “Three Musketeers” of radar in autonomous driving
- Why software-defined vehicles transform cars from tools into living spaces
- How Lucid is overtaking Tesla with smaller motors
- Wi-Fi 8 specification is on the way: 2.4/5/6GHz triple-band operation
- Wi-Fi 8 specification is on the way: 2.4/5/6GHz triple-band operation
- Vietnam's chip packaging and testing business is growing, and supply-side fragmentation is splitting the market
- Vietnam's chip packaging and testing business is growing, and supply-side fragmentation is splitting the market
- Three steps to govern hybrid multicloud environments
- Three steps to govern hybrid multicloud environments
- Serial port expansion
- HR made inappropriate remarks in the circle of friends, made a public apology, and was fired!
- 【AT-START-F425 Review】No.02 AT32F425 Development Environment Construction
- About the use of AWR1642BOOST development system
- Excellent "Internet of Things" (IoT) video recommendation, it explains it very thoroughly!
- Design of TPS53355 ripple injection circuit
- Latches and Flip-Flops
- How to realize serial communication between DSP and PC
- DIY GPS Tracker
- Why does the main function of C/C++ return 0?