A total investment of 1.38 billion yuan was signed for several projects including the semiconductor packaging material production line project

On August 25, Xihe District, Xinyang City, Henan Province held a signing ceremony for investment promotion projects.

Today's Xihe news showed that the signing included mobile phone complete machine and PCBA motherboard projects, display module core accessories manufacturing projects, semiconductor packaging material production line projects, and smart communication industry chain terminal projects, with a planned total investment of 1.38 billion yuan.

The total construction area of ​​the mobile phone complete machine and PCBA motherboard project and the display module core accessories manufacturing project is 100,000 square meters. It mainly constructs an electronic information industry park and supporting production facilities. After completion, it is expected to produce 3 million mobile phone complete machines and 10 million PCBA motherboards, display modules, camera modules, cover glass and other mobile phone core accessories annually.

According to the micro-publicity of the Jinniu Logistics Industry Cluster Zone, the total construction area of ​​the semiconductor packaging material production line project is 2,920.28 square meters, and it mainly produces semiconductor heat sealing cover tapes, carrier tapes and other packaging materials and other products; the total construction area of ​​the intelligent communication industry chain terminal project is 20,758.52 square meters, and it is mainly for the research and development, production and sales of smart devices, mobile phones and accessories, computers, electronic products, and electronic components.