The monthly production capacity of the first phase of the Xuzhou Xinjing project may reach 300,000 pieces by the end of next year

According to a news release from Jinlonghu, the perfect yield of crystal rods of various crystal growth furnace types of Xuzhou Xinjing Semiconductor Technology Co., Ltd. (hereinafter referred to as "Xinjing") has reached the international advanced level. This is a major milestone breakthrough in China's crystal growth technology.

It is reported that in October last year, the first phase of the Xinjing project with a monthly production capacity of 100,000 pieces was officially put into production, and the production capacity is expected to be expanded to 300,000 pieces per month by the end of 2022. According to previous public information, the first phase of the Xinjing large silicon wafer project invested 6.8 billion yuan to build a 12-inch semiconductor large silicon wafer growth and cutting, grinding and polishing production line with an annual planned production capacity of 3.6 million pieces.

At present, Xinjing has achieved sales and sampling of 12-inch large silicon wafers with nearly 20 downstream customers. In July, it achieved "zero" breakthroughs in key customers in Taiwan, China and the United States.

It is reported that Xinjing is committed to the research and development and manufacturing of 300mm semiconductor silicon wafers, directly cutting into 28 nanometers and below wafer process nodes. It has two R&D centers in the United States and China. Its core patents cover the entire silicon wafer manufacturing process, including crystal growth, cutting, grinding, polishing, cleaning, epitaxy, packaging, and silicon wafer testing.