On April 26, the power equipment for the first production line of the "Wafer Manufacturing + Advanced Packaging Project" of Bern Semiconductor (Shenzhen) Co., Ltd. (hereinafter referred to as Bern Semiconductor) was installed and will be put into production in May.
On November 3, 2020, Bern Semiconductor signed an agreement with the Wuzhi County Industrial New City Management Committee of Jiaozuo City, Henan Province, and China Fortune Land Development Co., Ltd. to settle in Wuzhi Industrial New City and invest 650 million yuan to build a "wafer manufacturing + advanced packaging project". After the project reaches full production, it will produce 4 billion ESD/TVS/TSS protection device chips annually.
According to China Fortune Land Development Industrial Park, Bern Semiconductor is a leading enterprise in the field of integrated circuit protection devices and a national high-tech enterprise. It has established a joint venture with the Chinese Academy of Sciences to build a Tianjin production base. The company focuses on the development and sales of high-quality, high-performance analog integrated circuits and power devices. Its main products include protection devices, power devices, driver ICs, interface chips, etc., realizing an industrial closed loop from wafer design, tape-out to packaging and testing.
Bern Semiconductor's products are used in 5G base stations, drones, automotive electronics, mobile phones, home appliances, power supply equipment, etc. Its main customers are Huawei, ZTE, Xiaomi, DJI, Hisense, Skyworth, Changhong, Kyushu, Luxshare, Lenovo, BYD, GAC, etc.
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