Liexin Semiconductor received approximately RMB 100 million in Series A financing, and the core RF front-end team came from Huawei HiSilicon

Recently, Liexin Semiconductor completed a nearly 100 million yuan Series A financing round, led by Jinpu Investment.

According to Yibai Capital, this round of financing will mainly be used to strengthen the company's product supply chain and R&D investment in new products, aiming to establish higher industry barriers in the field of Internet of Things.

Founded in 2018, Liexin Semiconductor is a company specializing in the research and development of RF front-end chips. The core team comes from industry-leading companies such as Skyworks and Huawei HiSilicon. They have more than ten years of rich design and market experience and have led the full-process research and development of mainstream RF front-end chip projects such as Sky Phase 2/3/6.

In September 2020, Liexin Semiconductor officially launched the world's smallest high-power OC568x series 5G RF PA chip into mass production. The chip supports China Broadcasting and Television's 5G n28 (700MHz) frequency band, and is also fully compatible with existing mainstream 4G/LTE multi-mode and multi-frequency technical requirements.

It is reported that the company will subsequently launch RF front-end PA chips (3mmx3mm) and PAMiD chips with higher integration and smaller size.

The person in charge of the Jinpu Investment Project said: "The company chose to firmly seize the market opportunity in the fiercely competitive PA field and open up the direction of the Internet of Things. Relying on the solid technical foundation and strong innovation ability of the Liexin Semiconductor team, it has developed a new architecture that adapts to market demand and achieved mass production in a very short period of time, winning the support and praise of end customers. I believe that Liexin Semiconductor will definitely become a dark horse in the RF field."