Star Semiconductor: Plans to raise no more than 3.5 billion yuan to invest in special process power chips

On the evening of March 2, Star Semiconductor released its plan for the private placement of A-shares in 2021. The total amount of funds raised from this private placement of shares will not exceed 3.5 billion yuan (including principal). After deducting relevant issuance expenses, the funds raised will be used to invest in high-voltage specialty process power chips and SiC chip research and development and industrialization projects, power semiconductor module production line automation transformation projects and to supplement working capital.

Among them, the high-voltage special process power chip and SiC chip R&D and industrialization project has a total investment of 2 billion yuan. It is planned to build new factories and warehouses and other supporting facilities, purchase photolithography machines, developers, etching machines, PECVD, annealing furnaces, electron microscopes and other equipment to achieve high-voltage special process power chips and SiC chip R&D and industrialization. After the project reaches full production, it is expected to form an annual production capacity of 360,000 power semiconductor chips. According to reports, the project implementation entity is the company's wholly-owned subsidiary Jiaxing Star Microelectronics Co., Ltd., and the planned construction period is 3 years.

The power semiconductor module production line automation transformation project has a total investment of 700 million yuan. It is planned to use the existing factory buildings to implement the production line automation transformation project, purchase fully automatic dicing machines, online fully automatic printing machines, online fully automatic placement machines, online fully automatic vacuum reflow furnaces, online fully automatic cleaning machines and other equipment, and implement the power semiconductor module production line automation transformation project. After the project reaches full production, it is expected to form an additional annual production capacity of 4 million power semiconductor modules. The project is implemented by Jiaxing Star Semiconductor Co., Ltd., and the planned construction period is 3 years.