An overview of 57 projects including Goodix, SK Hynix, Huajin, and Tongfu Microelectronics

      Jiwei.com News Overview of project progress in the integrated circuit field in January 2021:

More than 23 projects were signed, involving 17 regions in 8 provinces, including the Huajin Semiconductor Jiashan Advanced Packaging Project, Goodix Technology (Western) Headquarters Project, and the signing of a memorandum of understanding on cooperation between SK Hynix and the Dalian Municipal People's Government.

More than 15 projects have been started, involving 8 regions in 4 provinces, including Wingtech Technology's 12-inch automotive-grade semiconductor wafer manufacturing center project and Tongfu Microelectronics Phase III project;

More than 15 projects have been put into operation, including Qingdao HKC, Huatian Technology Kunshan, Funeng and many other projects.

【Contract】

Hesai Technology Super Factory Signed in Shanghai Jiading

On January 6, at the launch ceremony of a new round of construction and the first phase of major projects in Jiading New City, Hesai Technology’s super factory was signed in Shanghai Jiading.

The planned Hesai Super Factory, with a total investment of 2.1 billion yuan, will independently develop and build dozens of laser radar production line equipment, and introduce dozens of imported equipment such as high-precision placement machines and wire bonding machines for the production of mechanical radars. The main products are mechanical laser radars, multi-sensor fusion systems, etc.

Huajin Semiconductor signed an advanced packaging project in Jiashan

On January 23, at the Jiashan Integrated Circuit Industry Development Seminar and Industrial Project Signing Ceremony, Huajin Semiconductor Jiashan Advanced Packaging Project was signed with Jiashan Economic and Technological Development Zone.

The total investment of the project is 2 billion yuan, and the total investment of the first phase of the project is expected to be 1.34 billion yuan. Huajin Semiconductor plans to build a fan-out packaging mass production base based on domestic equipment in Jiashan Economic Development Zone, focusing on the business needs of high-end fan-out packaging of leading domestic enterprises, and developing "multi-chip wafer-level fan-out packaging technology" and "large-size FO chip FCBGA packaging technology".

Goodix Technology Headquarters Project Signed in Chengdu

On January 28, at the signing ceremony of major projects in Chengdu Hi-tech Zone, Goodix Technology announced that it plans to invest 1 billion yuan to build the Western R&D and Ecological Headquarters project in Chengdu Hi-tech Zone to carry out R&D business in related fields such as CMOS image sensing, audio software solutions and low-power Bluetooth.

SK Hynix Signs Memorandum of Understanding on Cooperation with Dalian Municipal People’s Government

On January 29, SK Hynix, the Dalian Municipal People's Government and the Dalian Jinpu New District Management Committee formally signed a memorandum of understanding on cooperation via video. The two parties will work together to promote SK Hynix's acquisition of Intel's Dalian chip factory and subsequent new investment projects in Dalian.

【start】

Wingtech Technology's 12-inch automotive-grade semiconductor wafer manufacturing center project started

On January 4, at the 2021 Shanghai Major Project Groundbreaking Ceremony, the Lingang New Area Wingtech Technology 12-inch automotive-grade semiconductor wafer manufacturing center project was officially started. The project has a total investment of 12 billion yuan, and is expected to produce 400,000 wafers per year. The power device products after packaging and testing can be widely used in automotive electronics, computing and communication equipment, and the production value will reach 3.3 billion yuan per year.

The third phase of Tongfu Microelectronics project started

On January 15, Nantong Suxitong Science and Technology Industrial Park held a concentrated start-up ceremony for industrial projects in the first quarter of 2021 and the groundbreaking ceremony for the Tongfu Microelectronics Phase III project.

The total construction area of ​​Tongfu Microelectronics' Phase III intelligent chip packaging and testing project is 95,400 square meters. After the project is completed, it will have an annual production capacity of no less than 1.5 billion integrated circuit products and 100,000 wafer-level packages.

It is reported that the Nantong Tongfu project will be implemented in three phases. After completion, it will become one of the largest domestic and internationally leading integrated circuit advanced packaging and testing industrialization bases.

新昇半导体新增30万片集成电路用300mm高端硅片研发与先进制造项目开工

1月4日，在上海市重点产业项目集中开工仪式上，新昇半导体新增30万片集成电路用300mm高端硅片研发与先进制造项目开工。

新昇目前已建设完成一期15万片/月产能目标，累计实现销售已超过170万片。正在建设二期30万片/月产能将于2021年底达成，届时将会形成产能规模效应。新昇将立足临港新片区，实现100万片/月产能建设最终目标。

[Capping]

Hunan Sanan Semiconductor Project's largest single M2B chip plant capped

On January 19, the largest single M2B chip factory building of the Hunan Sanan Semiconductor Project successfully completed the topping-out ceremony. This topping-out ceremony marked the completion of the first third-generation semiconductor industrial park project (Phase I) Section I in Hunan Province. It is expected that the project will be fully put into production in mid-2021.

The Changsha Sanan third-generation semiconductor project has an investment of 16 billion yuan and is built in two phases. The current phase one of the project mainly includes the construction of silicon carbide crystal growth, substrates, epitaxy, chips, device packaging and other factory buildings and related supporting facilities. After the project is fully completed and put into production, it will form two parallel silicon carbide research and development and production full industrial chain production lines.

【Product offline, production start】

Funeng Power Semiconductor Project achieves product rollout

On January 27, the Funeng Power Semiconductor Project rolled off the production line.

According to Dazhong Daily, this marks the entry of Shandong's first chip processing and manufacturing line into the actual production stage, filling the gap in the province's integrated circuit industry.

The Funeng Power Semiconductor Project is built in three phases. The eight-inch plant put into production this time is the first phase of the project. After the first phase of the first phase is put into production, it is expected to reach an annual production capacity of 360,000 pieces of 8-inch silicon-based power devices and 10,000 pieces of 6-inch silicon carbide power devices.

Qingdao HKC 6-inch wafer semiconductor project goes online

On January 6, the launching ceremony of the HKC Qingdao 6-inch wafer semiconductor project was held, which means that the first batch of 6-inch wafer semiconductor projects independently designed and produced for the market in Shandong Province have entered the mass production stage.

After HKC's 6-inch wafer semiconductor project reaches full production, the project will produce 200,000 chips and 100,000 WLCSP packages per month.

It is reported that after the project reaches full production, it will become the largest single-unit power device production base in China.

Huatian Technology's Kunshan automotive wafer-level advanced packaging production line project went into production

On January 6, the high-reliability automotive wafer-level advanced packaging production line project of Huatian Technology (Kunshan) Electronics Co., Ltd. was officially put into production. This is the world's first intelligent production line in the packaging and testing field that uses a fully automated overhead crane system.

Xiao Shengli, chairman of Huatian Group, said that after the project reaches full production, the annual output of high-reliability wafer-level integrated circuit advanced packaging for sensors will increase by 360,000 pieces, with an annual added output value of 1 billion yuan.