Signed! Will the pace of localization of integrated circuit core equipment accelerate?

On February 3, the Beijing Economic and Technological Development Zone held a signing ceremony for the "Two Districts" construction projects with the theme of "Sharing Opportunities, Seeking Cooperation, and Win-Win Development". 129 key projects signed "Entry Agreements into the Zone" with a total investment of nearly 400 billion yuan.

Among them, Zuo Lei, Chairman and Party Secretary of China Electronics Equipment, signed a letter of intent for investment through cloud signing. The China Electronics Technology Group Corporation (Beijing) integrated circuit core equipment independence and industrialization project entered the core engineering sector of the development zone, which will accelerate the localization process of my country's integrated circuit core equipment.

It is reported that the China Electronics Technology Group Corporation (Beijing) Integrated Circuit Core Equipment Independence and Industrialization Project is committed to building a national integrated circuit equipment innovation platform, accelerating the research and development and industrialization of high-end equipment such as ion implanters, CMP, and advanced packaging. It is of great significance to solving the problems of broken and short chains in the national integrated circuit industry and building an equipment system to support the independent and controllable development of my country's integrated circuits.