Recently, the State Intellectual Property Office announced two mobile phone appearance patents of Huawei. The mobile phones in these two patents both use an under-screen camera design. They were applied for by Huawei Technologies Co., Ltd. to the State Intellectual Property Office of China on October 28, 2019. Each patent contains 7 mobile phone product pictures.
Image source: State Intellectual Property Office
The first appearance patent shows a picture of a mobile phone with an under-screen camera. From the top view and the bottom view, the phone has no speakers and is expected to use screen sound. From the front view and the side view, the phone adopts a waterfall screen design and has no physical buttons for volume and power. The back has a vertical triple-camera system. The third lens is rectangular, which may be a periscope zoom lens. The flash is located between the second and third lenses.
Image source: State Intellectual Property Office
The second appearance patent is similar to the first one in front shape, with a circular camera on the back that can accommodate four camera lenses, all of which are circular, similar to the Mate series.
Previously, Xiaomi and OPPO have both demonstrated engineering machines with under-screen camera technology, but there has been no news of mass production. Now Huawei's under-screen camera appearance patent has also been exposed. I wonder who will be the first to mass-produce this technology. Let's wait and see.
Previous article:iQOO Neo3 becomes a band guitarist? The 3,000 yuan phone is really good with its sound quality
Next article:OFILM plans to raise 6.758 billion yuan to strengthen its optical and optoelectronic production lines
Recommended ReadingLatest update time:2024-11-15 13:27
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Wi-Fi 8 specification is on the way: 2.4/5/6GHz triple-band operation
- Wi-Fi 8 specification is on the way: 2.4/5/6GHz triple-band operation
- Vietnam's chip packaging and testing business is growing, and supply-side fragmentation is splitting the market
- Vietnam's chip packaging and testing business is growing, and supply-side fragmentation is splitting the market
- Three steps to govern hybrid multicloud environments
- Three steps to govern hybrid multicloud environments
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Could you please tell me what does 4.400:4.000:... mean in the following candece constraint rule line width?
- Ding~~The latest week's evaluation information has been delivered!
- TI blog post How GaN FETs with integrated drivers and self-protection enable next-generation industrial power designs
- [National Technology N32G430] 1. Unboxing
- CircuitPython 5.0.0 Beta 0 released
- MicroPython Newsletter Issue 8
- Contact information of forum administrator during the May Day holiday in 2021!
- 0R resistors, beads and inductors
- RVB2601 evaluation board trial 2 PWM use, that is, three-color small light drive
- GPIO register group in C6455