IDM, storage, 12-inch wafers, Hangzhou plans to start three major projects with a total investment of 71 billion

Recently, the Hangzhou Development and Reform Commission issued the "Hangzhou City 2020 Key Implementation Project Image Progress Plan" (hereinafter referred to as the "Key Implementation Projects") and the "Hangzhou City 2020 Key Preparation Project Preliminary Work Plan" (hereinafter referred to as the "Key Preparation Projects"), which mentioned multiple semiconductor projects.

The "Key Implementation Projects" mentioned the Xinmai IDM analog integrated circuit chip production line project and the Qingshan Lake Science and Technology City high-end storage chip industrialization project; the "Key Preparation Projects" mentioned the Hangzhou Jihai Semiconductor Co., Ltd.'s monthly production of 20,000 12-inch integrated circuit manufacturing projects. All three projects are scheduled to start construction in 2020.

Specifically, the planned construction period of Hangzhou Jihai Semiconductor Co., Ltd.'s 20,000-piece 12-inch integrated circuit manufacturing project is 2020-2021, with a planned total investment of 35 billion yuan and a total land area of ​​about 400 acres. The project is planned to be built in two phases. The planned production capacity of the first phase of the project is 20,000 pieces/month (12-inch wafers). In order to effectively control investment risks, the first phase of the project will be implemented in two stages. In accordance with the minimum investment scale standards of mature large factories in the industry, and taking into full consideration factors such as the optimal investment in key equipment such as lithography machines, the planned production capacity of the first phase is 4,000 pieces/month; after the successful implementation of the first phase, the second phase will be launched to achieve the industrialization capacity of 20,000 pieces/month in the first phase. After the successful implementation of the first phase, the project will start the second phase construction at an appropriate time, adding 40,000 pieces/month (12-inch wafers).

The total investment of Xinmai IDM analog integrated circuit chip production line project is planned to be 18 billion yuan. It is planned to build an IDM analog integrated circuit chip production base with a total land area of ​​about 700 mu. The overall plan is implemented in two phases. The first phase covers about 360 mu of land. The project is expected to complete the land transfer agreement negotiation in the first quarter, the land will be removed in the second quarter, and the project will be approved in the third quarter, and strive to start construction in the fourth quarter of this year.

The total investment of the Qingshan Lake Science and Technology City high-end storage chip industrialization project is planned to be 18 billion yuan. The project is planned to cover an area of ​​180 mu and a total construction area of ​​100,000 square meters. A production line with a monthly output of 20,000 12-inch 28-nanometer new high-end integrated circuits will be built. The project is expected to sign a mass production agreement in the first quarter, deepen the mass production feasibility study in the second quarter, carry out construction drawing design in the third quarter, and strive to start construction in the fourth quarter of this year.

Based on the above information, the total planned investment in the above three semiconductor projects is 71 billion yuan.