Qualcomm Snapdragon 875 decrypted: TSMC 5nm process, X60 5G baseband chip

Foreign media 91mobiles reported that Qualcomm is expected to release its next-generation flagship chip Snapdragon 875 later this year as its first 5nm chip mobile platform.

According to reports, the Snapdragon 875 will be Qualcomm's first chip with the new X60 5G modem-RF. It is not clear whether the 5G modem will be integrated or optional. In addition, the upcoming Snapdragon 875 chipset is codenamed SM8350, which is not surprising considering that its predecessor was codenamed SM8250.

Here are the key features and specifications of Snapdragon 875:

Kryo 685 CPU built on Arm v8 Cortex technology

3G/4G/5G modems – millimeter wave (mmWave) and sub-6 GHz bands

Adreno 660 GPU

Adreno 665 VPU

Adreno 1095 DPU

Qualcomm Security Processing Unit (SPU250)

Spectra 580 Image Processing Engine

Snapdragon Sensors Core Technology

External 802.11ax, 2×2 MIMO, and Bluetooth Milan

Compute Hexagon DSP using Hexagon Vector Extensions and Hexagon Tensor Accelerator

Four-channel package-on-package (PoP) high-speed LPDDR5 SDRAM

Low-power audio subsystem incorporating the Aqstic Audio Technologies WCD9380 and WCD9385 audio codecs

According to IT Home, the Snapdragon 875 will be manufactured using the latest 5nm process, so it will bring significant performance and graphics improvements and higher energy efficiency compared to the Snapdragon 865.

The Snapdragon 875 is expected to be released in December 2020, but considering the impact of the epidemic, it may be delayed to early 2021. Another certainty is that the Snapdragon 875 will be produced by TSMC.