According to Sichuan Online, on June 25, Wang Jingpo, co-president of H3C Group, was interviewed on the eve of the opening of the 2019 Sichuan Business Development Conference and introduced the relevant situation of H3C's Chengdu layout.
Currently, H3C has a R&D team of more than 6,500 people and 10,000 invention patents.
Wang Jingpo introduced that H3C has invested 7 billion yuan in Chengdu, including 1 billion yuan in a cloud computing company, which mainly carries out cloud computing-related R&D and services, driving the rapid development of emerging technology-related industries such as cloud computing and big data. At the same time, it invested 1 billion yuan to build a new R&D center and Chengdu Research Institute, which mainly focuses on cloud ecological technology, 5G technology and next-generation storage technology innovation and industrialization. In addition, it also invested 5 billion yuan in a semiconductor technology company, focusing on independent innovation and R&D of high-end router core chips.
In addition, the semiconductor technology company plans to start production in two years, which will drive the upstream and downstream industrial chains and the entire Sichuan information industry circle.
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