Intel launches first system-level foundry for the AI ​​era

Intel announced a new process technology roadmap, cooperation with customers and ecological partners to achieve its goal of becoming the world's second largest foundry by 2030.

• Intel launches Intel Foundry, the first system-level foundry for the AI ​​era, which is in a leading position in terms of technology, resilience and sustainability.
  

• Intel Foundry announced its latest process roadmap, including Intel 14A process technology, evolved versions of professional nodes, and new Intel Foundry Advanced System Assembly and Test capabilities to help customers achieve success in the AI ​​field. success.

• Intel foundry announced new customers: Microsoft CEO Satya Nadella said that a chip designed by Microsoft plans to be produced using the Intel 18A process node.

• Ecosystem partners including Synopsys, Cadence, Siemens and Ansys announced that their verification tools, design flows and IP portfolios are ready to support the designs of Intel foundry customers.

Today, Intel announced the launch of Intel Foundry, a more sustainable system-level foundry built for the AI ​​era, and expanded its roadmap to establish and consolidate process technology leadership in the next few years. . Intel also highlighted growth momentum from its foundry customers and increased support from ecosystem partners. Ecosystem partners such as Synopsys, Cadence, Siemens and Ansys have confirmed that their tools, design flows and IP portfolios have been verified for Intel's advanced packaging and Intel 18A process technology, which will accelerate the chip design of Intel's foundry customers.

Pat Gelsinger, CEO of Intel Corporation, said: "AI is profoundly changing the world and the way we think about technology and its 'core' power. This is a great opportunity for innovative chip design companies around the world and for the AI ​​era, The industry's leading system-level foundry service - Intel Foundry - brings unprecedented opportunities. Intel Foundry can work with customers to open up new markets, change the way people use technology, and make their lives better. "

The process roadmap after “four years and five nodes”

Intel has expanded its process technology roadmap, adding Intel 14A and several evolved versions of professional nodes. Intel also confirmed that its "five process nodes in four years" roadmap is still progressing steadily and will be the first in the industry to provide backside power supply solutions. Intel is expected to regain process leadership with the Intel 18A process node in 2025.

Intel's new process roadmap includes evolved versions of Intel 3, Intel 18A and Intel 14A technologies. For example, Intel 3-T is optimized for 3D advanced packaging design through silicon via technology and will soon be ready for production. Intel also highlighted its progress on mature process nodes, such as the new 12nm node announced in January this year jointly developed with UMC. Intel Foundry plans to launch a new node every two years and launch evolved versions of the node along the way, helping customers continuously improve their products through Intel's leading process technology.

In addition, Intel Foundry also announced that FCBGA 2D+ will be included in Intel Foundry Advanced System Packaging and Test (Intel Foundry ASAT) technology portfolio. The portfolio will include FCBGA 2D, FCBGA 2D+, EMIB, Foveros and Foveros Direct technologies.

Customer milestone: Microsoft becomes new Intel 18A customer

Intel's customers have expressed support for Intel's system-level foundry. Microsoft Chairman and CEO Satya Nadella announced in a speech at the Intel Foundry Direct Connect conference that Microsoft plans to use the Intel 18A process node to produce a chip it designed.

Satya Nadella said: "We are in the midst of a very exciting platform transformation that will fundamentally change the productivity of every business and entire industries. To realize this vision, we need advanced, high-performance and high-quality semiconductors Reliable supply. This is why Microsoft is excited about cooperating with Intel foundry and plans to use Intel 18A process node to produce a chip designed by us."

Intel Foundry already has a large number of customer design cases on various generations of process nodes (including Intel 18A, Intel 16 and Intel 3) and Intel Foundry ASAT (including advanced packaging).

Overall, Intel foundry's expected lifetime deal value exceeds $15 billion in wafer fabrication and advanced packaging.

IP and EDA suppliers: Prepare for chip designs based on Intel process and packaging technology

IP (intellectual property) and EDA (electronic design automation) partners Synopsys, Cadence, Siemens, Ansys, Lorentz and Keysight said the tools and IP are ready to help foundry customers accelerate Intel 18A based on the industry's first backside power supply solution Advanced chip design for process nodes. In addition, these partners also confirmed that their EDA and IP have been enabled on various Intel process nodes.

At the same time, for Intel EMIB 2.5D packaging technology, several suppliers also announced plans to cooperate in developing assembly technology and design processes. These EDA solutions will ensure that Intel can develop and deliver advanced packaging solutions to customers faster.

Intel also announced the "Emerging Business Initiative" (Emerging Business Initiative), which will cooperate with Arm to provide advanced foundry services for system-level chips (SoCs) based on Arm architecture. This program supports start-ups to develop technologies based on Arm architecture and provides necessary IP, manufacturing support and financial assistance, providing Arm and Intel with important opportunities to promote innovation and development.

System-level foundry: The differentiated advantages of Intel foundry in the AI ​​era

Intel's system-level foundry model provides full-stack optimization from factory network to software. Intel and its ecosystem deliver continuously improving technologies, reference designs and new standards that enable customers to innovate at the entire system level.

Stuart Pann, Intel's senior vice president of foundry, said: "Intel provides industry-leading foundry services and delivers them through resilient, more sustainable and secure supply sources. This complements the company's strong silicon system capabilities. Combined, these advantages , allowing Intel to meet customers' every need. Intel Foundry can help customers develop and deliver solutions smoothly for even the most demanding applications."

Global, resilient, more sustainable and trusted system-level foundry

In terms of sustainability, Intel's goal is also to become a leader in the foundry industry. In 2023, according to preliminary estimates, the renewable electricity usage rate of Intel's factories around the world will reach 99%. At Intel Foundry Direct Connect, Intel reiterated its commitment to 100% renewable electricity, water positivity and zero waste to landfill by 2030. In addition, Intel also re-emphasized its commitment to achieve net-zero Scope 1 and Scope 2 greenhouse gas (GHG) emissions by 2040 and net-zero upstream Scope 3 GHG emissions by 2050.