Semtech Announces Production of Tri-Edge™ PAM4 CDR Chipset

Publisher:EE小广播Latest update time:2022-01-05 Source: EEWORLDKeywords:Semtech Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

Semtech Announces Production of Tri-Edge™ PAM4 CDR Chipset to Support 100G Data Center Fiber Links


The new CDR chipset is based on the industry-leading 200G and 400G GN2558 and GN2559 Tri-Edge chipsets.

Extensions can help achieve lower power consumption, lower latency and lower costs for multimode fiber links up to 100 meters


January 5, 2022 - Semtech Corporation (NASDAQ: SMTC), a global leading supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms, announced that its latest Tri-Edge™ CDR chipsets, GN2538 and GN2539, have been fully mass-produced to help the next generation of data centers achieve multimode fiber interconnection. The GN2538 is a dual-channel 50G PAM4 CDR with an integrated VCSEL driver; while the GN2539 is a dual-channel 50G PAM4 CDR with an integrated linear transimpedance amplifier (TIA). As the latest members of the mature Tri-Edge CDR platform, the low power consumption and easy deployment advantages of the GN2538 and GN2539 chipsets can help major data centers upgrade their internal interconnection levels and improve overall performance.


As more industries and consumers turn to online activities such as streaming, social media, e-commerce and telemedicine, the demand for information is growing, which has accelerated the change in data center requirements. The COVID-19 pandemic has further accelerated the trend of data usage, and as more companies conduct business online, the availability of data and computing has received unprecedented attention. Semtech's Tri-Edge SR CDR solution achieves low power consumption and low latency performance, enabling seamless data transmission as data rates continue to grow, while providing lower power consumption, helping to reduce the impact of data centers on the environment.


“Our customers have thoroughly tested these solutions and confirmed their interoperability with 100G ports of commercial Ethernet switches used in major data centers,” said Julius Yam, Data Center Product Marketing Manager for Semtech’s Signal Integration Products Group. “The integration provided by the analog PAM4 GN2538 and GN2539 chipsets reduces costs while delivering the ideal low power and low latency performance required for high performance computing (HPC), artificial intelligence (AI) and cloud data center networks. The chipsets are also fully compliant with the Open Eye MSA standard for 50G per lane multimode fiber.”


The GN2538 integrated laser driver includes proprietary VCSEL compensation to enable a wide range of VCSEL selection, fully adaptive input equalization, and easy startup to simplify system setup. The GN2539 integrated linear TIA provides excellent receiver performance and reliable adaptability, and includes configurable output de-emphasis for a robust and compatible electrical interface.


Semtech Tri-Edge Data Center Product Resources


GN2538 product page

GN2539 product page

GN2558 product page

GN2559 product page


Semtech Optical Products Overview


Semtech’s optical networking product platform delivers high performance signal integrity to optical module solutions used by industry leaders in data center applications, enterprise networks, wireless infrastructure, passive optical networks and fiber access markets.


All statements contained herein that are not statements of historical fact, including the use of the words “designed to” or other similar words or expressions, that describe Semtech Corporation’s or its management’s future plans, objectives, or goals, are “forward-looking statements” and are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995, as amended. These forward-looking statements involve known and unknown risks, uncertainties and other factors that could cause Semtech Corporation’s actual results to be materially different from the historical results and/or from any future results or outcomes expressed or implied by such forward-looking statements. Such factors are further addressed in Semtech Corporation’s annual and quarterly reports and in other documents or reports filed with the Securities and Exchange Commission (www.sec.gov), including, without limitation, those under the captions “Management’s Discussion and Analysis of Financial Condition and Results of Operations” and “Risk Factors.” Semtech Corporation assumes no obligation to update any forward-looking statements in order to reflect events or circumstances that may arise after the date of this release, except as required by law.


Semtech and the Semtech logo are registered trademarks or service marks and Tri-Edge is a trademark or service mark of Semtech Corporation or its affiliates.



Keywords:Semtech Reference address:Semtech Announces Production of Tri-Edge™ PAM4 CDR Chipset

Previous article:TI helps the high-speed optical module market by providing highly integrated power solutions with smaller packages
Next article:Semtech Announces Production of Tri-Edge™ PAM4 CDR Chipset

Latest Network Communication Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号