PC802 chip and physical layer software accelerate its small
Hangzhou, China, December 16, 2021 - Picocom, a professional company in the 5G O-RAN baseband semiconductor and software industry, announced today that Kiwi Communications, a company focused on small cell product development, has confirmed that it will use Picocom PC802 chips in its new 5G small cell products. Kiwi Communications has introduced Picocom chips and 5G physical layer software to accelerate the development and market launch of its small cell products.
“We are pleased to work with Jiwei Communication to use our chips and software in its next generation small cell products,” commented Dr. Yingbo Jiang, CEO of Picochip Microelectronics (Hangzhou) Co., Ltd. “We have just launched the PC802 physical layer chip and supporting physical layer software to the market, and we look forward to seeing products using PC802 being put into the market and undergoing field trials in 2022.”
"We are very satisfied with the performance and software of the 5G small base station chip products launched by Picochip . We believe that Picochip has a strong team and advanced design concepts, and has the traditional advantages of leading the industry. We hope to cooperate more and more closely with Picochip in the future." Mr. Lin Ping, General Manager of Kiwi Communication Technology (Shenzhen) Co., Ltd. said, "We are very pleased to choose Picochip as a partner and look forward to bringing 5G small base station products with PC802 as the core to the market."
The flexible and low-power PC802 chip released by Picocom is the industry's first 5G chip for optimizing distributed and integrated small base stations. PC802 supports 4G/5G. It uses the FAPI protocol (defined by the SCF Small Base Station Forum) to communicate with the MAC layer and provide physical layer services to the MAC layer. PC802 integrates the eCPRI interface to communicate with the RU as a fronthaul, and can also be seamlessly connected to the wireless transceiver through the integrated JESD204B interface.
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