Broadcom Integrated acquires Adveos to strengthen its wireless communications chip capabilities

On December 28, Broadcom Integrated Circuit (Shanghai) Co., Ltd. (SSE: 603068), a major company in the field of wireless communication solutions, announced that it has reached a final agreement to acquire Adveos Microelectronic Systems, a Greece-based RF and mixed-signal IP supplier. 

Adveos is a fabless semiconductor design company that provides ASIC design services and develops RF, analog and mixed-signal IP cores. Adveos supports a growing international customer base and has become a reliable partner for global first-tier brand companies. The company designs and develops a variety of technology products and application solutions that are widely used in various consumer electronics, communication networks, medical equipment, etc. Adveos has offices in Athens, Greece and Yerevan, Armenia.

This acquisition will further strengthen Broadcom Integrated's competitiveness in the field of wireless communication chips. At a time when wireless communication is developing rapidly and is a major opportunity in domestic and foreign markets, this acquisition will enhance Broadcom Integrated's development momentum in this key market. In addition, this acquisition also further clarifies Broadcom Integrated's strategic decision to gradually grow into a world-class wireless solution provider.

Mr. Pengfei Zhang, Chairman of Broadcom Integrated, said: "Broadcom Integrated has long been focused on the design and development of wireless communication ICs, providing complete wireless communication solutions for various application scenarios such as smart home, smart transportation, and the Internet of Things. The acquisition of Adveos will strengthen Broadcom's strategic position in these markets, bring new growth opportunities in terms of revenue and products, and enhance the company's market competitiveness and long-term profitability. Adveos is a world-class team, and their joining will surely accelerate the realization of our vision of becoming a leading wireless transmission chip supplier. Our goal is to further expand the team in Athens and significantly strengthen the European team in the next few years."

"We are excited to be part of such an outstanding team at Beken and look forward to working together in the development of next-generation wireless platforms," ​​said George Dimitropoulos, CEO and co-founder of Adveos. "This is an exciting opportunity for Adveos to become a key member of the Broadcom Integrated family in designing the next generation of wireless products that will help improve the lives of millions of people."

It is understood that the ADVEOS core team has been deeply involved in the semiconductor industry for decades and has rich experience in the design of application-specific integrated circuits such as RF circuits, analog circuits, and mixed signals. It has become a chip solution provider for many customers including Intel and Cisco.

At present, ADVEOS has technical experience with major wafer foundries including TSMC, UMC, Intel, IBM, ST Microelectronics, and X-FAB and LFoundry specializing in sensor applications. Based on rich project experience, ADVEOS can provide technical solutions, whether it is system architecture or transistor level, covering all key modules in the "hottest" system applications, such as low noise amplifiers, power amplifiers, up and down conversion mixers, voltage controlled oscillators (VCOs), phase-locked loops, digital-to-analog converters (DACs), analog-to-digital converters, low-pass filters, variable gain amplifiers (VGAs), band gaps, etc.

At the same time, Broadcom Integrated, as a platform that provides a full range of wireless transmission chip R&D and artificial intelligence solutions, has covered more than ten wireless communication protocols and standards including Bluetooth, Wi-Fi, DECT, NFC, ETC, 2.4GHz, etc., and has a leading market share in multiple fields such as domestic consumer electronics and industrial application wireless ICs. After the completion of the acquisition, the two parties will play a synergistic role, enrich the product layout, help Broadcom Integrated enhance its core competitiveness in the field of wireless communication chips, achieve substantial development in the fields of smart home, Internet of Things and smart transportation, and accelerate Broadcom Integrated's progress towards a world-class wireless solution provider.