Renesas Launches First Second Generation DDR5 MRDIMM Complete Memory Interface Chipset Solution for Servers

New multiplexed registered clock drivers, multiplexed data buffers and PMICs enable next generation MRDIMMs

Speeds increased to up to 12,800 Mbps to meet the demands of AI and high-performance computing applications

Beijing, China, November 20, 2024 - Renesas Electronics, a global supplier of semiconductor solutions, today announced that it is the first to launch a complete memory interface chipset solution for second-generation DDR5 multi-capacity dual in-line memory modules (MRDIMMs).

The increasing demand for memory bandwidth in artificial intelligence (AI), high-performance computing (HPC), and other data center applications requires new DDR5 MRDIMMs. They operate at speeds of up to 12,800 megatransfers per second (MT/s); a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas played a key role in the design, development, and deployment of the new MRDIMMs, working with industry leaders including CPU and memory vendors, as well as end customers.

Renesas has designed and launched three new key components: RRG50120 second-generation multiplexed registered clock driver (MRCD), RRG51020 second-generation multiplexed data buffer (MDB), and RRG53220 second-generation power management integrated circuit (PMIC). In addition, Renesas also mass-produces temperature sensor (TS) and serial presence detection (SPD) hub solutions, and provides comprehensive chipset solutions for various types of server and client DIMMs, including industry-standard next-generation MRDIMMs. As an outstanding manufacturer in the field of memory interfaces, Renesas is committed to providing users with high-quality, high-performance products and services.

“Demand for higher performance systems for AI and HPC applications continues to grow. Renesas is keeping pace with this trend by working with industry leaders to develop next-generation technologies and specifications,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. “These companies rely on Renesas to provide the technical expertise and production capabilities to meet the growing demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs demonstrate Renesas’ leading position in this market segment.”

Renesas' RRG50120 second-generation MRCD is used in MRDIMMs to buffer the command/address (CA) bus, chip select, and clock between the host controller and DRAM. It reduces power consumption by 45% compared to the first generation. This is a key indicator for thermal management in ultra-high-speed systems. The RRG51020 Gen 2 MDB is another key device used in MRDIMMs to buffer data from the host CPU to DRAM. Both Renesas' new MRCD and MDB support speeds of up to 12.8 gigabits per second (Gbps). In addition, Renesas' RRG53220 next-generation PMIC provides excellent electrical overvoltage protection and superior energy efficiency, and is optimized for high current and low voltage operation.

Availability

Renesas is now sampling the RRG50120 MRCD, RRG51020 MDB, and RRG53220 PMIC. Production of the new products is expected to begin in the first half of 2025.