FORESEE ePOP3 is lightweight and creates unlimited possibilities in limited space

　　In recent years, the concept of wearable devices has continued to be popular. This portable device is not only used as hardware, but also can realize powerful functions through software support, data interaction, and cloud interaction. Nowadays, wearable devices are getting smaller and smaller, and have also become our daily contact from a very unrealistic concept. Unconsciously, our food, clothing, housing and transportation have all been "embedded" by smart wearable devices.

　　Even the Winter Olympics that just ended used "wearable motion sensors" in the competition venues to collect a large amount of basic data from short track speed skaters. The display stage for smart wearable devices can be seen everywhere.

　　Recently, FORESEE, an industry storage brand under Longsys, has followed the market "trend" and launched the embedded "fashion darling" ePOP3, jointly promoting the deep integration of intelligence and application markets with industry customers from the "source".

　　(FORESEE ePOP3)

　　Cutting-edge performance and design

　　ePOP3 integrates eMMC and LPDDR in the same package, and currently provides the market's mainstream 8GB+8Gb and 8GB+4Gb capacity combinations, with a maximum thickness of 0.9mm, and is equipped with a low-power mode (compared to the normal mode, power consumption can be reduced by up to 30%), effectively improving the endurance of terminal devices. Among them, NAND Flash uses high-performance flash memory chips, and the DRAM rate can reach up to 1600Mbps, which perfectly balances performance, durability and stability, achieving the effect of 1+1 greater than 2.

　　(The main parameters)

　　Born for smart wearable devices

　　ePOP3 meets the device's needs for storage and caching data, and can easily handle devices with higher integration. It is more suitable for terminal applications such as smart wearables and educational electronics that have higher requirements for miniaturization and low power consumption.

　　(main application)

　　Save 40%~60% of terminal equipment PCB space

　　As users' requirements for the appearance, size, weight, and performance of smart devices gradually increase, terminal manufacturers need to improve the level and quality of raw materials on the one hand, and maximize the space utilization of each PCB board on the other hand. The ePOP3 "two-in-one" packaging technology integrates RAM and ROM, and can be mounted on top of the compatible host CPU, optimizing the PCB board routing design, greatly saving the internal space of the device, allowing smart terminals to have multi-tasking capabilities without having to worry about insufficient internal component space.

　　(2 in 1)

　　Optimize the end customer's procurement bill of materials

　　ePOP3 adopts TFBGA stacking packaging technology, which can simplify the procurement of two materials for customers, namely embedded multimedia chips and dynamic random access memory (DRAM), to a single material procurement, thus streamlining the supply chain of components and reducing costs while keeping the supply cycle under control.

　　(Integrated packaging)

　　Selected resources ensure long-term stable quality and supply

　　FORESEE ePOP3 uses original resources. All particles, from access to finished products, are verified by Longsys' comprehensive quality management system at every step. By managing every link including customer needs, product development, material selection and production delivery, we strengthen stocking and backup to ensure long-term stable supply demand.

　　1/ The Flash used in this product has greater advantages in lifespan and stability compared to conventional TLC Flash.

　　2/ DRAM adopts the new generation 20nm process. Compared with the old 30nm process of the previous generation, the performance is further improved while the cost is controllable.

　　Comprehensive software and hardware testing solutions bring a "qualitative" leap

　　FORESEE ePOP3 adopts the SLT chip testing solution independently developed by Longsys, which innovatively achieves large-scale testing of eMMC (FT, RDT) and LPDDR high frequency in the same product at the same time, realizes batch automatic testing machines, and independently develops test programs. The number of simultaneous tests can reach 256 and is expandable. It can realize eMMC testing, DRAM speed testing, functional testing, power consumption testing and other testing capabilities in the same product, to protect product quality.

　　(Automated testing machine)

　　Outlook

　　Since its establishment 11 years ago, Longsys' embedded storage product line has gained considerable experience in application fields such as smart wearables, IOT, and smart phones, and has the ability to deliver products that meet various customer requirements. With the gradual maturity and popularization of technologies such as AI/VR/AR, smart wearable devices will become an important node in the field of artificial intelligence. This year, the embedded storage product line will continue to upgrade and expand existing product specifications and selections. Main products such as ePOP4x, eMMC, eMCP, and UFS are all included. More capacity combinations and performance combinations fully cover intelligent terminal applications, providing customers with diverse choices.