Substations interconnect different voltage levels and form a critical link between transmission, distribution and consumption. Primary equipment such as power transformers, circuit breakers and disconnect switches located in the substation switchyard protect and manage the grid power supply. Auxiliary devices such as protection relays and terminal devices are usually located away from the switchyard in the control room panel to protect, control and monitor the primary devices.
Measuring electrical parameters in conventional substations
Conventional instrument transformers such as voltage transformers (PT) and current transformers (CT) measure the high voltage and current flowing through the primary device. Copper wires connect the analog output of the transformer to the auxiliary device, and the number of copper wires increases depending on the application.
Figure 1 shows that separate CTs and PTs for protection, control, and monitoring lead to installation and maintenance complexity due to the large amount of copper wires, and increase potential failures that lead to higher costs. In addition, the use of multiple transformers results in different primary current and voltage digital values within the device, limiting system performance and reliability.
Digital Substation
The digital substation is part of the secondary system and includes all protection, control, measurement, condition monitoring, recording and supervision systems related to the primary process.
Figure 1 CT and PT wiring in a conventional substation using copper wires.
Digital substations replace hundreds (sometimes thousands) of meters of copper wires between switchyards and intelligent electronic devices (IEDs) with a few fiber optic cables. Digital substations that use fiber optic cables for communication use conventional or non-conventional instrument transformers (NCITs) and merging units to digitize data related to the process parameters being measured. Using less copper makes digital substations simpler, more compact, and more efficient.
Figure 2. Digital substation architecture
Digital Substation Architecture
According to the definition of the International Electrotechnical Commission (IEC) 61850 standard, the digital substation architecture includes three levels: process level, bracket level and station level, as shown in Figure 2.
Each level performs a specific function and the applications work together to implement the digital substation functions.
The process level includes power transformers, instrument transformers and switchgear.
The process level is the interface between primary and auxiliary (protection and control) components. In a traditional substation, the interface is hardwired using copper cabling; currents and voltages are passed to the protection and control panels at acceptable standardized auxiliary signal levels, while control cables send and receive status information. In a digital substation, all data - analog and binary - is digitized close to the source and sent to the IED over fiber optic cables using the IEC 61850-9-2 protocol.
The bay level includes auxiliary devices or IEDs such as bay controllers, protection relays, fault recorders, and meters. IEDs no longer have analog inputs because data acquisition occurs at the process level. Consolidated inputs can also reduce or eliminate the need for binary inputs, enabling compact devices that typically occupy only half the traditional footprint. IEDs handle protection and control algorithms and logic, make trip/no-trip decisions, and provide IEC 61850-based communication capabilities for lower (process) and upper (station) level Ethernet networks. Communication network redundancy is a typical requirement to ensure the highest availability and reliability. Two IEC 62439 standards - High Availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) - facilitate IED interoperability and integration from different vendors into substation networks.
The station level includes substation computers, Ethernet switches, and gateways. In addition to the traditional supervisory control and data acquisition (SCADA) bus, the substation bus provides additional communication capabilities because it allows multiple clients to exchange data; supports point-to-point device communication; and links to gateways for inter-substation and wide-area communication. Station-level devices may include substation human-machine interfaces (HMIs), engineering workstations accessed by IEDs or local centralization and archiving of power system data, SCADA gateways, proxy server links to remote HMIs, or controllers.
Measuring electrical parameters using merging units
The merging unit converts the instrument transformer output to a standardized Ethernet-based data output and implements IEC 61850.
Figure 3. Merging unit with conventional transformer
In a digital substation, instead of connecting the sensor outputs to protection and control devices at the bay level, merging units are placed near the sensors that are connected to the master devices at the process level.
The merging unit converts analog signals (voltage, current) into sampled values based on IEC 61850-9-2 for protection, measurement and control, and communicates with the IEDs in the substation via digital communication, as shown in Figure 3. Some key merging unit functions include analog-to-digital conversion, resampling, synchronization with a global time base, sample conversion to IEC 61850-9-2 protocol, and communication with the IEDs using a fiber-optic Ethernet interface.
The merging unit performs the necessary processing to generate an accurate, time-aligned output data stream of sampled values in accordance with the IEC 61850-9-2 standard. This processing includes sampling of analog values; accurate real-time referencing; message formatting into sampled values; and publishing of a single data source to measurement, protection, and control devices.
Key technology drivers for the merged unit:
•High-performance precision ADC with excellent AC performance specifications, high input impedance, low measurement accuracy drift and low power consumption.
•A signal processor for real-time processing of sampled values and implementation of standard substation communication protocol capabilities.
•High-speed Ethernet physical layer (typically 100 Mbps, moving to 1 Gb) with fiber-optic interface.
• Precise time synchronization (microseconds), including GPS-based once-per-second pulse input and IEEE 1588 Precision Time Protocol.
•Use NCIT which is more secure and accurate.
•IEC 61850 standards, including IEC 61850-8-1, Generic Object-Oriented Substation Event Messages and Sample Values for IEC 61850-9-2LE.
•IEC 62439-3 redundancy, including HSR for redundant ring architectures and PRP for redundant star architectures.
•Cybersecurity to ensure secure communications and enhanced safety.
Key challenges in designing a merging unit
There are multiple challenges when designing a merge unit. Some of the key challenges that impact architecture and performance include:
•Choose an ADC that can scale the sampling rate and synchronize the sampling with a precise global timing reference.
• Increase the number of analog input channels by connecting multiple ADCs to the host processor and capturing data in real time.
•Capture sampling in real time to meet protection and measurement sampling requirements.
• Use Ethernet communication with fiber optic interface.
• Implements communication protocols according to IEC 61850-9-2 and enables sampled data to be communicated to multiple users without packet loss.
• Enables the protocol stack to be used to implement redundancy protocols, including HSR, PRP, and time synchronization based on the Institute of Electrical and Electronics Engineers (IEEE) 1588 Precision Time Protocol (PTP).
• Implement multiple I/Os, including binary inputs (16 or more inputs), covering wide AC and DC inputs and DC sensor inputs and outputs, with expansion options.
• Reliable operation in harsh switchyard environments with high transients, higher ambient temperatures and magnetic fields.
Solving Merge Cell Design Challenges
Integrated circuits and reference designs from Texas Instruments (TI) can help designers meet these challenges. Figure 4 shows the functional blocks in a merging unit.
The merging unit consists of multiple subsystems described below that are interconnected to perform signal scaling/capture, processing, and communication functions. The unique features and capabilities (in brackets) of the TI recommended devices simplify the selection of key components and minimize the design effort.
•The processor module (using AM3359 or AM4372 or AM5706 or AM6548) is connected to the ADC using the Programmable Real-Time Unit Industrial Communication Subsystem (PRU-ICSS) and includes a Digital Signal Processor (DSP) core for processing electrical parameters and algorithms and an Arm® Cortex®-A15 microprocessor subsystem for external communications, user interface, and execution of substation communication protocols.
• Ethernet interface (DP83822, DP83840) over fiber optic cable or copper wire to connect to a host using Media Independent Interface (MII) or Simplified MII and hardware-assisted IEEE 1588 PTP-based time for communication synchronization at 100 Mbps.
•AC/DC (using UCC28600, UCC28740, UCC24630) wide input, high efficiency, synchronous rectifier based power supplies.
• A DC/DC power tree (using LMZM33604, TPS82085) that includes high-efficiency power modules with small size, integrated inductor, and > 2-A load current, with fast transient response and reduced electromagnetic interference (EMI) due to integration of the controller, high-side and low-side FETs, and inductor in one package.
Figure 4. Block diagram of the merging unit.
Figure 5. Merging unit connected to non-conventional instrument transformer.
• Memory termination (using TPS51200, TPS51116) using JEDEC-compliant source or sink double data rate (DDR) termination LDOs or an all-in-one DDR power management device with a synchronous buck controller, LDO, and buffered reference.
Previous article:Ten ways for startups to die, which are very valuable for start-ups
Next article:LIGO and Virgo may discover two new gravitational wave signals from the same black hole
- Popular Resources
- Popular amplifiers
- Red Hat announces definitive agreement to acquire Neural Magic
- 5G network speed is faster than 4G, but the perception is poor! Wu Hequan: 6G standard formulation should focus on user needs
- SEMI report: Global silicon wafer shipments increased by 6% in the third quarter of 2024
- OpenAI calls for a "North American Artificial Intelligence Alliance" to compete with China
- OpenAI is rumored to be launching a new intelligent body that can automatically perform tasks for users
- Arm: Focusing on efficient computing platforms, we work together to build a sustainable future
- AMD to cut 4% of its workforce to gain a stronger position in artificial intelligence chips
- NEC receives new supercomputer orders: Intel CPU + AMD accelerator + Nvidia switch
- RW61X: Wi-Fi 6 tri-band device in a secure i.MX RT MCU
Professor at Beihang University, dedicated to promoting microcontrollers and embedded systems for over 20 years.
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- CGD and Qorvo to jointly revolutionize motor control solutions
- CGD and Qorvo to jointly revolutionize motor control solutions
- Keysight Technologies FieldFox handheld analyzer with VDI spread spectrum module to achieve millimeter wave analysis function
- Infineon's PASCO2V15 XENSIV PAS CO2 5V Sensor Now Available at Mouser for Accurate CO2 Level Measurement
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- A new chapter in Great Wall Motors R&D: solid-state battery technology leads the future
- Naxin Micro provides full-scenario GaN driver IC solutions
- Interpreting Huawei’s new solid-state battery patent, will it challenge CATL in 2030?
- Are pure electric/plug-in hybrid vehicles going crazy? A Chinese company has launched the world's first -40℃ dischargeable hybrid battery that is not afraid of cold
- How to use PieVectTable in DSP2812
- Single-chip MEMS clock generator
- Discuss STM32H750——by RCSN
- Goodbye 2019, hello 2020+ Busy days never change
- Help with esp8266 micropython issue
- [RISC-V MCU CH32V103 Review] + Hardware SPI drive OLED display DHT11 temperature and humidity
- Multi-channel LED driver
- X-NUCLEO-IKS01A3 sensor test based on STM32F401RE development board 4 LIS2MDL magnetometer test
- Issues that need attention when initializing SPI of TI C2000 series 280049 chip
- Oh my god! As an electronic engineer, you are still using Baidu to search for information?