Samsung announced that it has completed the development of the 5nm process using extreme ultraviolet (EUV) technology. In addition, 7nm products will be officially shipped in April, and the goal is to mass-produce 6nm products this year!
Samsung Electronics said that the development of its 5nm FinFET process technology has been completed and samples can now be provided to customers. By adding another cutting-edge node to its extreme ultraviolet (EUV)-based process products, Samsung said it has once again demonstrated its leadership in the advanced foundry market.
According to reports, Samsung's 5nm process is 25% smaller in area, 20% less in power consumption, and 10% more powerful than its 7nm process. In addition, the 5nm process can use the 7nm design IP, which will help 7nm process customers reduce the design costs of the 5nm process.
Earlier, TSMC announced ahead of Samsung that it had completed the development of the 5nm process and is expected to enter trial production in the second quarter. Who between TSMC and Samsung will be the first to mass production has become the focus of the industry. Samsung's global wafer foundry market share has increased to 19.1% in the first quarter of 2019, but there is still a considerable gap from TSMC's 48.1%.
In addition, Samsung announced the shipment and mass production schedule of 7nm and 6nm wafer foundry. Samsung said that it will start mass production of 7nm products using EUV process in early 2019, and it is expected to ship in April. For the 6nm process, it is negotiating production agreements with major customers, has completed the design, and is expected to enter mass production in the second half of 2019.
Just now, TSMC launched 6nm technology services!
Today, facing Samsung's sudden addition of 6nm technology, TSMC is not to be outdone. Tonight, TSMC submitted a notice stating that it will launch 6nm technology services. TSMC's 6nm technology provides customers with more cost-effective advantages and continues the leading position of 7nm technology in power consumption and performance. TSMC's 6nm technology has an 18% increase in logic density compared to 7nm technology!
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