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Next is the wire bonding process, which uses metal wires to bond the die and DBC. The most commonly used wires are aluminum wires, and other commonly used wires include copper wires, copper tapes, and aluminum tapes.

There will be a series of appearance inspections and static tests during the process, and modules with problems will be scrapped directly;

Repeat the above process to weld and bond the DBC to the copper base plate, followed by glue filling, encapsulation, laser coding and other processes;

A final functional test will be performed before leaving the factory, including dynamic testing of electrical performance, insulation testing, reverse bias testing, etc.

4. What are the common automotive IGBT module packaging types?

Econodual series half-bridge packages are mainly used in commercial vehicles, with main specifications of 1200V/450A, 1200V/600A, etc.

HP1 full-bridge package is mainly used in small and medium-power models, including some A-class cars, most A0 and A00 cars, with peak power generally within 70kW, and the main model is 650V400A, and other specifications include 750V300A, 750V400A, 750V550A, etc.;

HPD full-bridge package, used in medium and large power vehicles, most A-class vehicles and above, with 750V820A specifications occupying the mainstream of the market, and other specifications such as 750V550A, etc.;

DC6 full-bridge package, based on the integrated packaging solution of UVW three-phase full-bridge, has the characteristics of compact packaging, high power density and good heat dissipation performance;

TO247 single tube parallel connection, there are also a small number of electric control system solutions using TO247 single tube packaging on the market. The advantages of using a single tube parallel connection solution are mainly two points: ① The single tube solution can realize flexible line design, and the corresponding single tube can be used in parallel according to the required current, so the cost also has certain advantages; ② The parasitic inductance problem is easier to solve than the IGBT module. However, there are also some difficulties to be solved when using single tubes in parallel: ① It is difficult to share and balance the current between each parallel single tube, and it is difficult to ensure consistency, such as achieving simultaneous disconnection, the same current, temperature, etc.; ② The customer's system design and process are very difficult; ③ There are many interfaces, and the requirements for the production line are very high.

5. What tests and verifications are required for automotive IGBT modules?

The requirements for product performance and quality of automotive IGBT modules are significantly higher than those in the consumer and industrial control fields. Therefore, automotive certification has become the most important barrier to the automotive IGBT module market. Generally speaking, automotive-grade IGBTs require a vehicle model introduction cycle of about two years.

The automotive IGBT module testing standards mainly refer to AEC-Q101 and AQG-324. At the same time, car companies will put forward corresponding requirements based on the characteristics of their own models. The main testing methods include: parameter testing, ESD testing, insulation withstand voltage, mechanical vibration, mechanical shock, high temperature aging, low temperature aging, temperature cycling, temperature shock, UHAST (high temperature and high humidity without bias), HTRB (high temperature reverse bias), HTGB (high temperature debiased), H3TRB/HAST (high temperature and high humidity reverse bias), power cycling, and solderability.

Among them, power cycling and temperature cycling are representative durability tests with extremely strict requirements. For example, the number of power cycles may range from tens of thousands to hundreds of thousands. The main purpose is to test the durability of mechanical connection layers such as bonding wires and solder layers. The failure mechanism during the test is mainly that the thermal expansion coefficients of chips, bonding wires, DBCs, solders, etc. are inconsistent, resulting in bonding wires falling off, breaking, chip solder layer separation, and solder aging.

China's automotive IGBT market situation

With the rapid development of the domestic new energy vehicle industry, the upstream of the industry chain is gradually completing domestic substitution and even leading the world trend, such as vehicle brands, power batteries, battery materials, etc. have already taken a relatively advanced step. The automotive electronic control IGBT module is the core power device of new energy vehicles. It has been monopolized by foreign suppliers such as Infineon, ON Semiconductor, Semikron, Mitsubishi Electric, etc., but with the rise of domestic suppliers such as BYD Semiconductor, Star Semiconductor, CRRC Times, Silan Microelectronics, Cuizhan Microelectronics, etc., it can now meet domestic demand to a certain extent. I believe that in the near future, domestic automotive semiconductor companies will be bigger and stronger!