From May 25 to 27, 2021, the 8th International Intelligent Connected Vehicle Technology Annual Conference, jointly organized by the China Society of Automobile Manufacturers Intelligent Connected Innovation Center, the Suzhou Automotive Research Institute of Tsinghua University, and the Beijing Economic and Technological Development Zone, opened in Beijing. With the theme of "Building an Open and Shared New Ecosystem of Intelligent Connected Vehicles", the conference discussed key technologies of automotive intelligence and networking, artificial intelligence technology, safety technology, high-precision maps and positioning technology, testing and evaluation technology, application and demonstration, technical standards and regulations, etc.
Following the electric revolution, the automotive industry has entered the second stage with intelligence and networking as the main content. The development of smart cars with autonomous driving technology and artificial intelligence technology as the core has become the focus of industry competition. At the same time, there are still technical bottlenecks that need to be broken through. The convening of this conference will promote the development of China's smart and networked car industry and technology, create a world-class technology exchange platform, and promote the early arrival of the era of truly intelligent cars.
At the meeting, Long Hongxing, assistant general manager and general manager of the technical research and development department of Chenxin Technology Co., Ltd., said that the road to localization of chips is not so easy. The scale of our chip production is particularly large, especially the chips for 5G+ Internet , which require large bandwidth, high speed, and low latency. In addition, there are many requirements for the complexity of chips. The challenges in this part are very large, and the investment is also very large. It can be said that our chips are indeed a very big challenge.
It has to complete the entire process, from the earliest IP selection to the entire design process, including the choice of your manufacturer, and the selection of your packaging plant and board factory, including the entire subsequent verification process, from the automotive standard certification of chip technology to the automotive standard certification of module products, to the system certification of the whole vehicle. The entire process takes about three to five years.
Domestic chips are indeed very challenging. The penetration rate was so low in the past few years because we did not pay enough attention and investment. Now I think there is such an opportunity. The era of domestic chips has arrived.
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