Multi-sensor platform reference design for automotive electronics

The Multi-Sensor Platform Reference Design for Advanced Driver Assistance Systems (ADAS) provides qualified developers with a fully functional evaluation platform to facilitate testing and development of ADAS applications primarily for the automotive industry. D3 also offers System-on-Module (SOM) solutions that include ADAS embedded processors (such as the TDA3x) that can be used with this reference design.

characteristic

Provides an easy-to-use base platform reference design (supports multiple LVDS-based automotive sensor systems) Provides a platform that enables plug-and-play of TDA3-based CPU modules (D3Engineering SOM) Provides a path to automotive-grade baseboards for use with other processor SOMs

characteristic

Compatible with D3Engineering's TDA3xSoCProcessorSOM

4 FPD-LinkIII inputs

HDMI input and output

USB, CAN bus and serial connections

It can be applied in the fields of surround view system (SVSECU), camera monitoring system (mirror replacement and vehicle-mounted), satellite radar system (long-range, medium-range and short-range) and sensor fusion system (ADAS domain controller).

The main chip is TI's TDA3x system-on-chip (SoC), a highly optimized and scalable series of devices designed to meet the requirements of leading advanced driver assistance systems (ADAS). The TDA3x series combines optimal performance, low power consumption, smaller form factor, and ADAS visual analysis and processing functions, which helps to achieve a more autonomous collision-free driving experience, and has been widely used in ADAS applications in the automotive field. Based on a single architecture, the TDA3xSoC supports the industry's widest range of ADAS applications (including front cameras, rear cameras, surround view, radar, and fusion technology), realizing complex embedded vision technology in today's automotive field.

The TDA3xSoC uses a heterogeneous scalable architecture, including Texas Instruments' (TI) fixed-point and floating-point TMS320C66x digital signal processor (DSP) generation cores, VisionAcceleraTIonPac (EVE) and dual Cortex-M4 processors. The device can be designed in a small form factor using different packaging options (including stacking packages), thereby achieving low-power configuration. The TDA3xSoC also integrates many peripherals, including multi-camera interfaces (parallel and serial) for LVDS surround view systems, displays, controller area networks (CAN) and Gigabit Ethernet video bridges (AVB). The VisionAcceleraTIonPac for this series of products includes an embedded vision engine (EVE), so the application processor no longer needs to perform visual analysis functions, while also reducing energy consumption. The VisionAcceleraTIonPac is optimized for visual processing functions, with a 32-bit RISC core for efficient program execution, and a vector coprocessor for professional visual processing.

In addition, TI provides a complete range of development tools for Arm, DSP and EVE coprocessors, including a C language compiler, a DSP assembly optimizer for simplified programming and scheduling, and a debugging interface for viewing source code execution.