Infineon Technologies and Paiand develop 3D depth sensing technology for Magic Leap 2

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Infineon Technologies and Paiand Develop 3D Depth Sensing Technology for Magic Leap 2 to Enable Cutting-Edge Industrial and Medical Applications


[June 14, 2022, Munich, Germany] Augmented reality (AR) applications will fundamentally change the way people live and work. Magic Leap, a pioneer in the AR field, is expected to launch its latest AR device Magic Leap 2 in the second half of this year. Magic Leap 2 is designed for enterprise-level applications and will become one of the most immersive enterprise-level AR headsets on the market. Magic Leap 2 is ergonomically designed, has industry-leading optical technology and powerful computing power, enabling operators to work more efficiently, helping companies optimize complex processes, and supporting employees to collaborate seamlessly. One of the core advantages of Magic Leap 2 is the use of 3D indirect time-of-flight (iToF) depth sensing technology jointly developed by Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and PMD.


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 Infineon pmd Magic Leap


Magic Leap 2 demonstrates the potential of the REAL3™ 3D image sensor. The new and improved IRS2877C time-of-flight imager can capture the physical environment around the user, helping the device to perceive, understand and ultimately interact with its surroundings. With its excellent VGA resolution, the 3D imager can detect details of many different objects.


The time-of-flight technology developed by Infineon and Paiand creates an accurate 3D map of the environment and 3D images of faces, hand details or objects in real time. This advanced technology enables Magic Leap 2 to interact accurately with its surroundings. In addition, the sensor can also support Magic Leap 2 to achieve enhanced gesture control functions. Infineon and Paiand have optimized the 3D sensor to minimize its power consumption, thereby reducing heat and extending the battery life of Magic Leap 2.


“Precise and real-time perception of your surroundings is key to augmented reality applications ,” said Julie Green, chief technology officer at Magic Leap. “Magic Leap 2 will deliver an even more immersive user experience. These extraordinary capabilities will help create a more seamless connection between the physical and digital worlds.”


“We are bringing 3D imaging to professional environments where precision and reliability are critical, ” said Andreas Urschitz, Chief Marketing Officer and President of the Power & Sensing Systems Division at Infineon Technologies. “The latest 3D Time-of-Flight technology will enable completely new augmented reality (AR) and mixed reality (MR) applications in the medical and industrial sectors. It will fundamentally change the way we live and work.”


“Our technology enables Magic Leap 2 to detect the changing positions of objects in the physical environment with millimeter-level accuracy, ” said Bernd Buxbaum, CEO of Paiand. “This allows virtual objects to be placed in the real world. They stay where they are when the user moves around the room, and are obscured when other real objects appear in front of them. This technology also works reliably in bright sunlight or complete darkness, where other depth sensing solutions quickly reach their limits.”


Increasingly, AR technologies will be applied in industrial and medical environments that rely on these advanced technologies. For example, Brainlab, a Munich-based digital medical technology company, combines its AI-driven, patient-specific human anatomy visualization software with Magic Leap’s spatial computing capabilities to help surgeons better understand the patient’s internal anatomical structure.


Keywords:Infineon Reference address:Infineon Technologies and Paiand develop 3D depth sensing technology for Magic Leap 2

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