Deca, ASE and Siemens team up to launch adaptive pattern design suite

Deca, a leading pure-play process technology provider for advanced semiconductor packaging, announces the launch of its new APDK™ (Adaptive Patterning® Design Kit) solution, a result of a collaboration between Deca, Advanced Semiconductor Engineering Ltd. (ASE) and Siemens Digital Industries Software.

Deca works closely with ASE, a leading global advanced packaging provider, and Siemens’ Calibre® platform, the industry’s gold standard for design verification, to enable end customers to realize the power of adaptive patterning while achieving breakthrough electrical performance while keeping all aspects of today’s advanced heterogeneous integration designs within manufacturing capabilities. 

Each APDK combines a full set of automation, design rules, design rule checking (DRC) platforms and templates in one package, providing a turnkey design flow. Each design is started by a template, while extensive automation guides designers from initial layout to adaptive pattern simulation, and finally completes the design sign-off using Siemens' Calibre software. APDK has achieved results in ASE, and it is ushering in a new era of high-density, heterogeneous integration.

Through its OSAT Alliance Program, Siemens Digital Industries Software has joined Deca’s AP Live Network, a growing supply chain ecosystem that includes Electronic Design Automation (EDA) vendors and Original Equipment Manufacturers (OEMs). Deca’s AP Studio module integrates the adaptive pattern design flow with Siemens’ EDA products, providing a total design solution and a proven platform.

“Across the industry, advanced packaging solutions, such as the M-Series, are key to the continued extension of Moore’s Law. With Adaptive Patterning, we have solved key manufacturing challenges, and now with the introduction of our first APDK, we are addressing the design complexities. Designers need a full-stack solution to quickly bring new products to market with a high degree of confidence in the end result, and we believe our APDK delivers that,” said Craig Bishop, CTO, Deca Technologies.

“ASE’s vision to bring automated design support to our customers is being realized with a powerful solution that addresses both single-chip and heterogeneous integration parameters,” said Rich Rice, senior vice president of marketing and technology evangelism at ASE. He continued, “With the M-Series in volume production, we are consistently delivering exceptional quality while solidifying our leadership in fan-out technology. We are especially pleased that both our designers and customers can optimize Deca’s APDK framework capabilities to deliver predictable and reliable next-generation fan-out product designs.”

“For years, the industry has trusted Calibre software as its verification signoff platform. Incorporating Calibre eqDRC and programmable edge mobility capabilities into this new APDK framework helps automate and validate the adaptive patterning design flow included in Deca’s AP Studio module. This helps designers gain confidence that they can succeed on the first pass,” said Michael Buehler Garcia, vice president of product management for Calibre Design Solutions at Siemens Digital Industries Software.

About Adaptive Pattern™

Deca's innovative adaptive patterning technology frees designers and manufacturers from being limited to fixed masks, enabling production flows to take into account natural variations without expensive process or design constraints. Compared to previous technologies, AP customizes each lithography layer on each device in real time as the product passes through the manufacturing process to ensure the highest possible yield and the highest performance design rules for ultra-fine interconnect pitch large channel contacts. Combined with the APDK framework, AP provides a seamless process from design to production.

About Deca Technologies

Deca was born out of a passion to change how the world makes advanced electronic devices. In our first decade, Deca’s 10X thinking has led to exciting breakthroughs for leading mobile semiconductor companies, including M-Series™ FX Fan-Out and Adaptive Patterning™. From its initial applications in traditional semiconductor packaging to the development of chiplets and heterogeneous integration, Deca’s technologies are setting new standards and providing key building blocks for the future of the semiconductor industry.