Lecture Preview | Surface and Interface Failure Analysis in Electronic Assembly

In the field of electronic assembly, surface usually refers to the external surface of printed circuit boards (PCBs), chips and other components, that is, the surfaces in contact with the surrounding environment. The quality of the surface can be controlled by precision processes such as cleaning, coating, chemical/electroplating, etc. The interface refers to the contact interface between different materials, such as the solder joints between electronic components and PCB boards, the bonding interface between different materials, etc. The interface is generally formed after electronic assembly processes such as wafer attachment, wire bonding, plastic packaging, surface mounting, through-hole assembly, and gluing. Every surface and every location on an interface is a potential failure area.

Through scientific research and control of surfaces and interfaces, failure problems or potential risks such as pollution, corrosion, wear, poor bonding, and fracture in electronic products can be effectively solved, thereby improving the assembly quality and reliability of electronic products. ZESTRON, a professional analysis, training and consulting provider in the field of electronic reliability, announced that it will hold an online lecture "Surface and Interface Failure Analysis in Electronic Assembly" at 3:00 pm on August 8, Beijing time. This lecture will be taught by Zhao Junliang, senior technical analyst of ZESTRON reliability and surface and failure analysis expert. He will elaborate on the concepts of surface and interface, analyze the failure modes related to surface and interface, and introduce various ideas and specific methods of failure analysis. Method of implementation.

ZESTRON sincerely invites industry professionals to make an appointment to discuss failure mechanisms and failure prevention with ZESTRON reliability and surface technology experts to continuously improve product reliability!