Siemens Digital Industries Software recently announced that it has joined the Intel Foundry Services (IFS) Acceleration Program as a charter member of the EDA Alliance. Intel's IFS program is committed to building a complete ecosystem to provide design and manufacturing support for next-generation chip-level systems (SoCs) based on IFS's leading process technologies.
The program is designed to promote collaboration between IFS and its ecosystem partners, focusing on reducing risks and eliminating design barriers while accelerating time to market for joint customers. Partners in the IFS Accelerator EDA Alliance can get early access to Intel process and packaging technologies, and jointly optimize and improve tools and processes to fully leverage Intel's technical capabilities.
“The IFS Ecosystem Alliance is an important step forward in Intel’s vision for the foundry industry, and we are very pleased to have Siemens EDA join the program,” said Rahul Goyal, vice president and general manager of Intel’s Product and Design Ecosystem Enablement Division. “Siemens’ superior EDA products combined with IFS’ leading process technology will provide design teams across the industry with the right solutions to compete in today’s competitive IC market.”
As a member of the alliance, Siemens will work closely with IFS to continuously optimize IC design tools, processes and methods for Intel's advanced processes. The first batch of Siemens EDA products certified by IFS include the industry-leading Calibre® nm platform and the Analog FastSPICE (AFS) platform, which provides advanced circuit verification capabilities for nanometer-level analog, radio frequency (RF), mixed signal, memory and customized digital circuits.
“As semiconductors play an increasingly important role in the global economy, IFS represents Intel’s commitment to the foundry market and drives new innovations,” said Joe Sawicki, executive vice president of IC-EDA at Siemens Digital Industries Software. “We are honored to work with IFS to provide optimized software solutions that help our mutual customers take full advantage of Intel’s process and packaging technologies to achieve innovation.”
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