DuPont expands Nikal™ BP electroplating chemicals range

DuPont expands Nikal™ BP electroplating chemistry portfolio with new boric acid-free nickel plating

The chemical is safer and ensures smooth surface morphology and uniform thickness of the metallization layer under the bump

WILMINGTON, Del., Sept. 24, 2021 — DuPont (NYSE: DD) Electronics & Industrial (DuPont) today announced the addition of Nikal™ BP BAF Ni to its family of electroplating chemistries. This boric acid-free addition is a safer plating option for under-bump metallization (UBM) packaging applications. 

UBM is an advanced packaging process that requires a thin-film metal layer stack between the integrated circuit (IC) or copper pillar and the solder bumps in a flip-chip package. This stack is critical to the reliability of the package and has three main functions:

• Establish electrical connections between the die and bumps;

• Forms a barrier to prevent unwanted diffusion; 

• Establish mechanical connection between bump and bump pad.

DuPont takes sustainability very seriously and is committed to improving the safety of innovative processes by design, guided by green chemistry principles. DuPont has established a corporate culture that promotes learning and collaboration to develop sustainable solutions for future development. Boric acid is a common buffer in traditional nickel sulfamate baths in the UBM process, but Nikal BP BAF Ni electroplating does not use boric acid. This new chemistry uses an alternative buffer, which not only strengthens DuPont's commitment to sustainability, but also speeds up the market's adoption of safer alternatives.

Nikal BP BAF Ni electroplated nickel is characterized by its ability to produce low porosity nickel deposits for wafer plating, making it ideal for semiconductor wafer applications requiring low stress nickel, solderability, UBM barrier layers and bump plating. It can also provide a high quality base layer for electroforming processes using gold, palladium, tin and tin alloys on semiconductor components.

“DuPont continues to be committed to quality improvement and product innovation. After years of hard work, our electroplating chemistries have accumulated a large number of excellent functional and reliability records in the customer’s hands, and we are also committed to integrating the concept of sustainability into our product and technology development. The development of Nikal™ BP BAF Ni electroplated nickel is the perfect combination of our philosophies,” said Junda Chen, global business manager of DuPont Electronics & Industrial Advanced Packaging Technologies.

Nikal BP BAF Ni is a single, ready-to-use chemistry that produces smooth surface morphology and uniform thickness with low foaming, long cell life, etc. Online measurement makes process control easier for users, and compatibility with traditional Nikal BP Ni ensures that existing users can simply replace it.

DuPont's reliable Nikal BP chemistry is designed to meet a wide range of customer needs and produces uniform deposits with excellent barrier capabilities, solderability and other properties that are critical to wafer manufacturing consistency.

Interested customers should contact your account manager to learn more about the Nikal BP range of electroplating chemicals.  

About DuPont Electronics & Industrial

DuPont Electronics & Industrial is a global supplier of new technology and high-performance materials for the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial and transportation industries. Top R&D scientists and application experts work closely with customers in advanced technology centers around the world to provide solutions, products and technical services to enable next-generation technologies.

About DuPont

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