New 4.5 kV XHP™ 3 IGBT module enables driver miniaturization and maximum efficiency

[ December 25 , 2023 , Munich, Germany] Many applications have seen a clear trend of using smaller IGBT modules and transferring complex designs to the upstream of the industry chain . In line with the global trend of miniaturization and integration, Infineon Technologies AG has launched the 4.5 kV XHP™ 3 IGBT module, aiming to fundamentally change the use of two-level and three-level topologies and the use of 2000 V to 3300 V AC The landscape of medium voltage frequency converters (MVDs) and transportation applications . The new semiconductor device will benefit a wide range of applications, including large conveyors, pumps, high-speed trains, locomotives and commercial, construction and agricultural vehicles (CAVs).

XHP3_IGBT

The XHP series includes a TRENCHSTOP™ IGBT4450 A half-bridge IGBT module with an emitter-controlled freewheeling diode, and a 450 A diode half-bridge module with an emitter-controlled E4 diode. The insulation voltage of both modules has been increased to 10.4 kV. This combination helps simplify paralleling and reduce size without reducing efficiency. Previously, parallel switching modules required complex busbars, complicating design efforts and adding inductance. The XHP series adopts an innovative design that simplifies parallel operation by placing the modules side by side, which also allows the modules to be connected in parallel with only one DC bus.

The 4.5 kV XHP Series also enables developers to reduce component count during the design process. The traditional IGBT solution for 3-level solutions has multiple single IGBT switches and a half-bridge diode, while the design using the new device only requires two half-bridge switches and a smaller half-bridge diode, which is an important factor in the integration of the driver. Significant progress.

The combination of the FF450R45T3E4_B5 dual switch and the DD450S45T3E4_B5 dual diode provides significant cost savings and reduced footprint. For example, Infineon's past IGBT solutions required four 140 x 190 mm² or 140 x 130 mm² switches and a 140 x 130 mm² dual diode. The new XHP series reduces the required component count to two 140 x 100 mm² dual switches and a smaller 140 x 100 mm² dual diode.

Availability​

Two models of IGBT modules FF450R45T3E4_B5 and DD450S45T3E4_B5 are now available.