High-frequency load point power supply is difficult, why? This high-current intelligent power driver solves the problem

Publisher:EE小广播Latest update time:2022-10-20 Source: EEWORLDAuthor: ADI IC设计工程师Yingyi Yan,ADI IC设计工程师Eugene Cheung,ADI Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

At present, new energy vehicles are in a stage of rapid development, which poses new challenges to the stable operation of power load power supply systems. Is there a new type of high-current load point converter that can meet the growing demand for high efficiency, high density, and reliable power levels in power load system design? In response to this, ADI has launched the LTC7050 SilentMOS™ series of intelligent power drivers, which has become a powerful tool to effectively solve the above problems.


Why ADI LTC7050 SilentMOS series is the first choice


The LTC7050 can be configured to power two independent power rails, each with separate on/off control, fault reporting and current sense outputs; or, the device can be configured as a dual-phase single output converter. The LTC7051 single channel 140A power stage leverages the LTC7050 core design to provide higher power density with a single inductor.


The LTC7050 dual-channel monolithic power driver fully integrates high-speed drivers and low-resistance half-bridge power switches, along with comprehensive monitoring and protection circuitry, in an electrically and thermally optimized package. With the right high-frequency controller, the power driver forms a compact, high-current regulator system with advanced efficiency and transient response. The Silent Switcher® 2 architecture and integrated bootstrap supply enable high-speed switching, reduce high-frequency power losses by attenuating input supply or switch node voltage overshoots, and minimize the accompanying EMI.


Low switch node stress enhances power stage robustness


In conventional buck regulator designs, the hot loop inductance between the input capacitor and the power MOSFET causes large spikes at the switch node. SilentMOS LTC7050 uses Silent Switcher 2 technology to integrate the critical VIN decoupling capacitor inside the LQFN package. The reduction of the hot loop leads to reduced parasitic inductance. In addition, the fully symmetrical layout eliminates electromagnetic fields. Figure 1 compares the LTC7050 layout with a conventional power driver. As shown in Figure 2, when the input voltage is 12V and the output is fully loaded, the peak voltage at the switch node is only 13V. There is ample margin between the peak voltage stress on the power MOSFET and its rated voltage, ensuring the reliability of the device. The fully integrated hot loop eliminates PCB layout sensitivity and makes complex electromagnetic cancellation design clearly visible to the user. To properly measure the switch node ringing, use a coaxial cable and solder it from the switch pin to the local ground, then measure the waveform on an oscilloscope with matched impedance.

image.png

Figure 1. The SilentMOS LTC7050 has a small, symmetrical internal thermal loop to minimize ringing. (a) shows the LTC7050 and (b) shows a conventional DrMOS module.


High efficiency and advanced packaging enable high power density


The LTC7050 has low conversion losses, making it more efficient than conventional DrMOS modules in high-frequency designs. The overlap time of the power device current and voltage is determined by the drive speed. In multi-chip DrMOS modules, the drive speed is limited by the inductance between the driver and the power MOSFET and between the driver and its capacitors. Driving the MOSFET gate too fast can cause overvoltage on the gate of the power device/driver and cause failure. In addition, high di/dt causes large spikes at the switch node because the thermal loop inductance cannot be ignored.


The LTC7050's driver is integrated on the same die as the power loop, and all gate driver capacitors are in the package. Since the bonding wires are eliminated, the parasitic inductance in each drive loop is close to zero. Compared with multi-chip DrMOS modules, the LTC7050 turns on and off power devices much faster. The typical rising edge of the switch node voltage is as short as 1ns, as shown in Figure 2. The best-in-class drive speed greatly reduces conversion losses. The high drive speed allows the LTC7050 to have zero dead time, which greatly reduces diode conduction and reverse recovery losses.

image.png

Figure 2. Switching node waveform; ILOAD = 25A/phase


Careful design improves power conversion efficiency at high switching frequencies. Figure 3 shows the 12V to 1.8V conversion efficiency and loss curves at 600kHz and 1MHz. For the 1MHz design, the peak efficiency exceeds 94%.

image.png

Figure 3. Efficiency and loss curves

Figure 4 shows the 12V to 1.0V conversion efficiency and loss curves at 600kHz and 1MHz.

image.png

Figure 4. Efficiency and loss curves


For the 1MHz design shown in Figure 4, the efficiency is almost 90% at 60A, while the total power loss (including inductor losses) is less than 7W. The thermal impedance of the LTC7050’s thermally enhanced 5mm × 8mm LQFN package is low at 10.8°C/W. The low losses and low thermal impedance allow the LTC7050 to replace two industry standard 5mm × 6mm DrMOS modules . Figure 5 shows the thermal image of the LTC7050 at 12V to 1V/60A conversion with a switching frequency of 1MHz. The case temperature rise is approximately 68°C over the entire temperature range.

image.png

Figure 5. Thermal image of the LTC7050


Test conditions: VIN = 12V, VOUT = 1V, IOUT = 60A, no airflow, board running continuously for more than 30 minutes.


Strict fault alarm and protection system ensures load safety


The LTC7050 series integrates a range of fault detection, alarm and protection features to ensure system safety.


The LTC7050 provides fully tested overcurrent protection for both the top and bottom FETs. When the power device extracts the instantaneous current flowing through the power FET, the devices on the same die should be matched. The monolithic architecture ensures that the effects of temperature and process variations are fully offset, and the parasitic effects that cause delays in the current sense signal are negligible. These inherent advantages of the monolithic architecture support real-time, accurate current monitoring and protection. Once the overcurrent comparator trips, the affected power device is latched off regardless of the PWM input, the FLTB pin is pulled low to report the fault to the controller, and the reverse device is turned on to continue the inductor current to zero. After the current ramps down to zero, the driver accepts only the PWM signal again. This protection scheme prevents the power stage from continuously jittering around the positive or negative current limit value, avoiding thermal stress on the device. Figure 6 shows the load current ramping up until the positive overcurrent protection is triggered.

image.png

Figure 6. LTC7050 overcurrent protection


To ensure that the power devices always operate in the safe operating area, the input overvoltage lockout feature of the LTC7050 forces both power switches to stop switching when the input voltage exceeds the OV threshold. If the power MOSFET is carrying a large current and OV is detected, the reverse power device will continue to flow as described above.


The LTC7050 family provides two temperature measurement interfaces for controllers (such as the LTC3884) or system monitors. The TDIODE pin is connected to a PN junction diode to measure the IC junction temperature using the VBE method or the ΔVBE method. TMON is a dedicated pin that reports the die temperature with an industry standard 8mV/°C slope. Unlike standard DrMOS modules that combine analog temperature monitoring with other fault alerts on a single pin, the LTC7050’s TMON is only pulled to VCC when the die temperature is at least 150°C. In other fault conditions, TMON will continue to report the die temperature when the FLTB open-drain output is pulled low. The monolithic architecture enables TDIODE and TMON to reflect the temperature of the power devices well. When multiple power stages are used in a multi-phase system, the TMON pins can be tied together to report the highest temperature.


Integrating the bootstrap diode and bootstrap capacitor into the package eliminates the need for a boost pin and the possibility of an accidental short circuit of the bootstrap driver. The voltage of the bootstrap driver is constantly monitored internally. If the voltage falls below the undervoltage threshold, the top FET is turned off to avoid excessive conduction losses.


in conclusion


The LTC7050 SilentMOS monolithic high current intelligent power driver is an excellent solution for high frequency point-of-load applications. The integrated hot loop with symmetrical layout brings many benefits. Fewer external components, smaller PCB size and lower bill of materials cost. Low switch node ringing enhances device reliability. Switching-related losses are low, so it can achieve high efficiency at high switching frequencies and allow the use of small inductors; the size of the output capacitor can also be smaller because the closed-loop bandwidth is higher. Comprehensive monitoring and protection features protect expensive loads under various fault conditions.


Reference address:High-frequency load point power supply is difficult, why? This high-current intelligent power driver solves the problem

Previous article:WPG Group launches brushless DC motor drive solution based on Infineon products
Next article:Melexis Launches Smaller, Fully Integrated LIN Driver IC for Relay-Controlled Window Lifters

Recommended ReadingLatest update time:2024-11-16 13:06

Principle and design of microcontroller driven buzzer
  A buzzer is an electronic sounder with an integrated structure. This article introduces how to drive a buzzer with a single-chip microcomputer. It is widely used as a sound-generating device in electronic products such as computers, printers, copiers, alarms, and telephones.   Buzzers are mainly divided into two ty
[Microcontroller]
Principle and design of microcontroller driven buzzer
Design of LED lighting driver power supply based on MP4021
Abstract: The working principle of the single-stage flyback high power factor light emitting diode (LED) lighting driver power control chip MP4021 is analyzed. By comparing it with the traditional L6562+constant current feedback chip solution, it can be seen that the LED driver power controlled by MP4021 has the adv
[Embedded]
Design of LED lighting driver power supply based on MP4021
TPS92560 High Transformer Compatibility MR16/AR111 LED Spotlight Driver Power Solution
summary     As a replacement lamp, the M16/AR111 LED spotlight must meet the requirements of high efficiency, reliability and economy, and its driver power design must also be compatible with the electronic transformer in the original MR16/AR111 halogen lamp power supply architecture. This article first starts with
[Power Management]
TPS92560 High Transformer Compatibility MR16/AR111 LED Spotlight Driver Power Solution
Using NanoPWM Drivers to Replace Linear Drivers in Precision Position Control Applications
introduce Many industrial applications, such as semiconductor wafer inspection systems, organic light-emitting diode flat panel display production and inspection, require extremely high motion performance, maintaining sub-nanometer static jitter and tracking errors in slow, uniform nano-motion. Linear servo drives hav
[Power Management]
Using NanoPWM Drivers to Replace Linear Drivers in Precision Position Control Applications
Linux 2.6.24.4 transplantation on S3C2410 (CS8900 network card driver) (based on GEC2410)
The SMDK2410 configuration uses the DM9000A network card by default, so we need to change it to the CS8900A network card driver. There are two ways to transplant the program found online. One is to use the previous version of the cs8900.c driver. Just add the ARM_CS8900 option in the configuration. There are many co
[Microcontroller]
C8051F020 touch screen driver control
C8051F020 touch screen driver control At present, touch screens and LCD screens have become commonly used input and output devices in embedded computer systems. Touch screens are divided into resistive, capacitive, surface acoustic wave, infrared scanning and vector pressure sensing touch screens, among which the mo
[Microcontroller]
C8051F020 touch screen driver control
Regulation-driven: Rolls-Royce's conception of pure electric vehicles
Rolls-Royce has jumped on the electrification bandwagon and has already produced its first electric car, but CEO Torsten Muller-Otvos admits that electrification is inevitable if the company wants to continue its current success in the future. Rolls-Royce is not a company that rushes to achieve quick results. Any de
[Automotive Electronics]
Regulation-driven: Rolls-Royce's conception of pure electric vehicles
Flexible solutions to adapt to the future Listen to ADI's interpretation of Industry 4.0
"As a semiconductor supplier, especially a leading supplier of analog devices, ADI has personally realized that customers must have very good technology partners. Not only must the existing products match the company's development, but the technology route must also be consistent with the company's future development.
[Industrial Control]
Flexible solutions to adapt to the future Listen to ADI's interpretation of Industry 4.0
Latest Power Management Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号