alpitronic builds 50 kW super charging station with Infineon CoolSiC™ modules and drivers

alpitronic uses Infineon’s EasyPACK™ CoolSiC™ modules and EiceDRIVER™ X3 drivers to build a 50 kW super charger

[Munich, Germany, December 27, 2021] Following the successful launch of the super charging piles HYC150 and HYC300, the Italian company alpitronic recently announced the launch of the industry-leading 50 kW DC charging pile HYC50. This product is the first wall-mounted DC charging pile in this power range. It has two charging ports and can quickly charge electric vehicles at a charging power of 50 kW, or charge two electric vehicles at the same time at a charging power of 25 kW. The product achieves the above functions by using Infineon Technologies AG's EasyPACK™ CoolSiC™ MOSFET 1B and 2B modules and EiceDRIVER™ X3 drivers.

Dr. Peter Wawer, President of the Industrial Power Control Division at Infineon Technologies, said: “We are committed to working closely with customers like alpitronic to help them realize their unique product designs and create excellent system-level solutions. Infineon has a comprehensive and deep understanding of the system and has accumulated rich industry experience to provide first-class solutions. For example, in Infineon’s extensive product portfolio, EasyPACK™ 1B and 2B modules with the latest 1200 V CoolSiC MOSFET technology can improve efficiency and power density. These devices can be flexibly combined with the appropriate EiceDRIVER™ driver to meet the needs of each customer and specific project.”

Philipp Senoner, co-founder and managing director of alpitronic , said: “We have significantly increased the efficiency of our new supercharger by using Infineon’s CoolSiC EasyPACK modules and driver ICs that are perfectly matched to them. We are therefore pleased to be working with such a strong and reliable company as Infineon, which not only offers us a range of CoolSiC MOSFETs and gate drivers, but also fully understands and meets our specific requirements.”

HYC50 uses Infineon's CoolSiC technology, with a charging efficiency of up to 97%, and realizes a bidirectional charging and discharging design. Therefore, the super charging pile complies with the vehicle-to-grid collaboration (V2G) mode and can perform bidirectional charging and discharging with the power grid. At the same time, the charging pile is compact, with dimensions of only 1250 x 520 x 220 mm³ and weighs less than 100 kg. The compact design makes the charging pile suitable for indoor wall-mounted installation, of course, it can also be flexibly installed on a base outdoors. HYC50 supports CCS1 and CCS2 charging standards with a maximum current of 150 A; in addition, it also supports CHAdeMO and GBT charging standards with a maximum current of 125 A.

One of the design features of the HYC50 product is the use of Infineon's EasyPACK™ 1B and 2B modules. The module integrates CoolSiC MOSFET, NTC temperature sensor and PressFIT press pins, which can increase power density by about 50%. In addition, due to the use of CoolSiC technology, the noise of the HYC50 super charging pile has been greatly reduced from 65 decibels to below 50 decibels.

In addition to the necessary power devices, Infineon also provides an adaptive gate driver for HYC50, namely the X3 series driver IC. The X3 series driver IC is a perfect match for the modules in HYC50 and can be flexibly configured.

In addition, in actual application, the HYC50 super charging pile can also be updated and upgraded through OTA technology, which may also affect the parameters of the gate driver. Therefore, the system under different climatic conditions can be adjusted accordingly according to the surrounding environment.

Product Status

EasyPACK CoolSiC MOSFET modules will be available in the first half of 2022.