How to perform USB 3.0 physical layer compliance testing

[Attachment:/uploadfile/Test_and_measurement/uploadfile/201102/20110217112015272.pdf] USB-IF launched the USB3.0 specification in November 2008. The technology was jointly developed by the USB3.0 promotion group composed of Intel, Microsoft, HP, NEC, NXP Semiconductors, TI and other companies. The transmission rate of USB3.0 reaches 5Gbps, which is ten times that of the original USB2.0. It is also backward compatible and supports USB2.0 devices. The USB3.0 specification introduces new consistency test requirements, and also brings multiple challenges to system and circuit designers. The increased bandwidth puts higher requirements on the transmission and signal fidelity of key signals. Tektronix has always been a leader in the USB testing industry: it was the first to launch the USB2.0 test solution; and it is the only company that provides test steps for Wimedia USB physical layer testing. At present, Tektronix is ​​the only test and measurement instrument company involved in the formulation of USB3.0 specifications! This article focuses on the physical layer characteristics and electrical characteristics consistency testing of USB3.0, and introduces Tektronix's complete consistency testing solution and its characteristics.

Introduction to USB 3.0

Why do we need USB 3.0?

Currently, USB2.0 has been widely used in the computer industry, and the transmission speed is sufficient for many products. However, the demand for high-speed transmission of large amounts of digital multimedia files in flash drives, external hard disks, digital cameras, media players, and mobile devices is the driving force behind the introduction of USB3.0. The introduction of USB3.0 makes it possible for users to copy high-definition movies from mobile hard disks within 1 minute.

The USB 3.0 specification jointly developed by Intel, HP, NEC, ST-NXP, TI and other companies will be widely used in personal computer peripherals and consumer electronics. USB-IF (USB Implementers Forum) is the organization that manages the USB 3.0 specification. The established USB 3.0 specification is managed by it, and then the organization will cooperate with hardware manufacturers to develop hardware products that support the USB 3.0 standard.

USB-IF members can use the PIL (Platform Interoperability Lab) to verify their early designs. The PIL lab provides USB developers with Host and Device consistency testing to ensure that the device can correctly interact with USB3.0 electrical and link layer signals.