Build the foundation for testing and verification of domestic compound semiconductor power devices
Shenzhen, China, June 15, 2023 – The strategic cooperation press conference between Tektronix Technology (China) Co., Ltd. and Silicon Electric Semiconductor Equipment (Shenzhen) Co., Ltd. was held at the Silicon Electric headquarters in Shenzhen Venture Capital Building. At the same time, Tektronix (China) and Silicon Electric Semiconductor announced the official establishment of the joint test and measurement laboratory.
There is no doubt that due to the dual carbon goals and green ecological policy trends, the ESG wave is coming, and third-generation semiconductors represented by SiC (silicon carbide) and GaN (gallium nitride) have become the preferred choice of high-performance device manufacturers , and power devices have also become a new highlight in the Chinese semiconductor market. The latest research report by market research firm Yole pointed out that the global power semiconductor device market will grow from US$17.5 billion in 2020 to US$26.2 billion in 2026, of which about 70% will come from the automotive market.
Along with this come the difficulties and challenges of testing and measurement in the research and development and production of third-generation semiconductor chips and power devices, such as high-voltage discharge, high-current testing, high-temperature performance testing, and ultra-thin warped wafer transportation.
As a leading manufacturer of batch point-testing equipment for domestic semiconductor production lines, Silicon Electric Semiconductor has mastered a number of core key technologies for probe testing after 20 years of technological accumulation. Its products cover integrated circuits, optoelectronic chips, discrete devices, third-generation semiconductors and other fields. As an internationally leading supplier of test and measurement solutions, Tektronix (China) can provide full-process semiconductor parameter testing solutions. The strong combination of Tektronix (China) and Silicon Electric Semiconductor will help to efficiently solve these testing difficulties in the industry, providing WAT, CP, WLR, KGD and other tests at the wafer-level test nodes, and dynamic and static parameter tests, packaging and testing, and reliability tests at the module-level test nodes, covering the entire process of compound semiconductor power devices.
Since Tektronix (China) and Silicon Power Semiconductor started cooperation in 2015, they have made breakthroughs and progress in the LED Wafer point test market. The signing of the strategic cooperation letter of intent between Tektronix and Silicon Power will "further develop and deepen the strategic cooperation in the Wafer Acceptance Test (WAT) market, in order to further develop the Chinese market, provide customers with overall solutions in the WAT testing field, and reduce costs for customers to improve competitiveness."
At the same time, the Silicon Power-Tektronix wafer-level probe test and measurement joint laboratory was officially established. This joint laboratory aims to strengthen the testing and verification capabilities of domestic compound semiconductor power devices, and further explore and optimize transient solutions based on high precision and high throughput. The laboratory provides a fully automatic probe station that can be used for 12-inch and 8-inch wafers.
• Supports high voltage and high current testing up to 3000V/100A
• Probe system test leakage current <100pA@1000V
• WLR supports TDDB, NBTI, PBTI, HCI and other test functions
• Support high temperature testing, the temperature can reach 200°C
• Special insulation design to avoid breakdown and sparking, static test maximum voltage 3000V, dynamic test maximum voltage 2000V
• The handling/probe part is separated from the test part, which is highly scalable
• Supports iron ring, blue film, waffle box, Tap Reel and other feeding and discharging methods
• Supports parallel testing of multiple stations
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