TDK Corporation is pleased to announce the launch of a demonstration kit for the mechanically decoupled ultrasonic sensor module USSM1.0 PLUS-FS (order code: B59110W2111W032). This component is very suitable for obstacle detection and distance measurement applications under harsh working conditions, such as under strong light illumination conditions and detecting transparent targets. It is widely used in autonomous mobile robots (AMR) or automatic guided vehicles (AGV).
The demo kit includes the TDK demo board, USB-A to Micro-B cable, two ultrasonic sensor modules, two sensor cables and two seals. The software package allows users to monitor sensor performance in multiple operating modes and provides digital IO and analog readings of echo traces. Demonstration boards help simplify early and later stages of development by visually showing what the sensor can detect and react in specific situations.
The USSM1.0 PLUS-FS demonstration kit has an IP65/67 protection level, which can effectively prevent external mechanical vibration from distorting measurement results. It is driven by a driver and an integrated piezoelectric disk, and is equipped with an integrated signal processor ASIC that can calculate signal propagation time at a repetition rate of up to 50 samples/second. As a result, the measurement distance range reaches 18 cm to 200 cm; in the pitch-receive mode through multiple modules, the measuring distance can even be as short as 4 cm.
Features and Applications
main application
Obstacle detection and anti-collision systems in mobile systems (such as AGV and AMR)
Distance measurement in stationary systems (e.g. liquid level measurement
Main features and advantages
Sensor module with integrated ASIC suitable for time-of-flight measurements
Rugged packaging and mechanical decoupling from the sensing element
Measuring range: 18 cm to 200 cm (short to 4 cm in pitch-catch mode)
Sampling rate up to 50 times/second
Programmable personalized measurement scenarios
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