With a total investment of 220 billion, domestic memory begins to be supplied! By the end of the year, the production capacity will account for 3% of the world

On September 20, 2019, Hefei Changxin announced the official mass production of DDR4 memory, becoming the first domestic memory supplier. Currently, the company's official website has begun to supply DDR4 chips, LPDDR4X chips and DDR4 modules.

We have previously introduced Changxin's DDR4 chips, LPDDR4X chips and DDR4 modules in detail. The biggest problem for them now is production capacity.

Changxin's domestic memory project has three phases. The first phase investment is about US$7.2 billion, and the expected production capacity is 125,000 wafers per month. This capacity is similar to the size of the memory factory invested by SK Hynix in Wuxi, and can account for 10% of the global memory chip production capacity.

However, previous news said that the current production capacity is only 20,000 wafers/month, which will not have any impact on the memory market. It is expected to expand to 40,000 wafers/month by the end of this year. This production capacity will account for about 3% of the global memory production capacity.

In terms of memory, Samsung is the world's largest memory supplier, with a market share of about 45%. Its production capacity is more than ten to twenty times that of domestic companies, and the gap is still very large.

Of course, in addition to the gap in production capacity, the gap in technology is also a problem. Changxin's memory is still based on the 19nm process, while Samsung has developed to the 1Znm process, which is about two or three generations ahead.

At the GSA+Memory Storage Summit in September 2019, Zhu Yiming, Chairman and CEO of Changxin Memory, delivered a keynote speech entitled "China's Storage Technology Development and Solutions", in which he mentioned the source of Changxin's DRAM memory technology, which was mainly the bankrupt Qimonda company, from which he obtained more than 10 million technical documents on DRAM and 2.8TB of data.

On this basis, Changxin Company improved Qimonda's 46nm process memory and developed a 10nm-level independent intellectual property memory chip at a cost of more than US$2.5 billion.

On September 21, 2019, at the 2019 World Manufacturing Conference, the Hefei Municipal Government signed an agreement with Changxin Memory Technologies Co., Ltd., OCT Group Co., Ltd., and North Huachuang Technology Group Co., Ltd. on the Hefei Changxin Integrated Circuit Manufacturing Base project.

The total investment of the Hefei Changxin Integrated Circuit Manufacturing Base project exceeds 220 billion yuan. It is located in the Hefei Airport Economic Demonstration Zone, covers an area of ​​about 15.2 square kilometers, and consists of three areas: the Changxin 12-inch memory wafer manufacturing base project, the Airport Integrated Circuit Supporting Industrial Park and the Hefei Airport International Town.

Among them, the total investment of Changxin 12-inch memory wafer manufacturing base project is 150 billion yuan; the total investment of Airport Integrated Circuit Supporting Industrial Park is more than 20 billion yuan, located west of Changxin Storage Project; Hefei Airport International Town has a total investment of about 50 billion yuan, with a planned area of ​​9.2 square kilometers and a total construction area of ​​4.2 million square meters, located north of Changxin Storage Project.

After the manufacturing base is fully built, it is expected to generate an output value of over 200 billion yuan, gather over 200 leading upstream and downstream enterprises, and attract over 200,000 talents of all kinds.