From October 11th to 13th, 2023, NEPCON ASIA Asian Electronic Production Equipment and Microelectronics Industry Exhibition (referred to as "NEPCON ASIA 2023") was held at the Shenzhen International Convention and Exhibition Center (Baoan New Hall). Tensun Tengsheng appeared in Hall 7 7B65 , the booth is equipped with a precision equipment display area, a keynote speech area, a technical exchange area, etc. The products are rich and technical, and the speeches are exciting and interactive, attracting many professional audiences to come and "take a seat" to communicate.
Tengsheng Precision team is ready
Tengsheng Precision focuses on the technology research and development and manufacturing of precision equipment. Its products mainly include precision dispensing equipment, precision cutting (dicing) equipment, precision bending wire equipment and 3C customized equipment. They are widely used in 3C consumer electronics, new energy, In fields such as display screens and semiconductor packaging, import substitution of high-end brands has been achieved.
Teng Sheng Precision booth 7B65 was fully occupied
What precision equipment and advanced technologies did Tengsheng Precision bring to this exhibition? Next, let’s walk into Tengsheng and witness its hot moments.
1
The diameter of the spray tin point is 150μm, the spray frequency is 150Hz, the industry-leading spray tin technology
Among the precision dispensing equipment, Tengsheng Precision brought the latest product, high-speed tin spraying equipment Sherpa700, and conducted a practical demonstration for everyone on site. The tin spraying effect can be directly observed through a high-precision microscope on site, which attracted a lot of attention. The audience stopped to watch and mingle.
According to the technical person in charge of the site, "Tengsheng's current spray tin point diameter can reach 150±10μm, and the stable spray frequency of solder paste is 150Hz, that is, 150 tin points can be sprayed per second, which is at the leading technical level in the industry!
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Applied to chips, PCBs, components and other products
High-precision micro-volume solder paste jet dispensing machine Sherpa700
Vice President Lu of Tengsheng Precision communicated with customers on site
Sherpa700 can be used for high-precision micro-volume solder paste printing of chips, PCBs, components and other products, micro-volume tin spraying and precision dispensing of semiconductor system-level packaging SIP and MEMS. The equipment has ultra-high responsiveness, with the response speed of the motion axis within 5ms; high speed, the maximum acceleration can reach 3G, and the maximum operating speed can reach 1500mm/s; high stability, cast one-piece frame and 1400KG body weight structure , the overall center of gravity of the fuselage is low, making the fuselage more stable during operation.
Teng Sheng Precision Equipment
Exhibition Area
Audiences at Tengsheng Precision booth stopped to watch
In addition, Tengsheng Precision also brought Sherpa91N, which is used in advanced semiconductor packaging dispensing, Sherpa93, a high-speed, high-precision double-head automatic dispensing machine used in the SMT industry, and Sherpa83, a dual-station, double-head high-efficiency dispensing machine. Tengsheng's many technologically advanced products are combined with independently developed piezoelectric injection valves JVS96 and JVS200, screw valve SVS81, volume metering dispensing valve SPP-H9 and other precision core valve body components, which can fully meet the advanced production of different customers. Dispensing process requirements.
High-precision dispensing machine Sherpa91N used in advanced semiconductor packaging dispensing process
Sherpa93, a high-speed, high-precision double-head automatic dispensing machine used in the SMT industry
Tengsheng Precision Core Valve Body Exhibition Area
2
UPH reaches more than 20K, fully mastering the core technology of JIG SAW
Among semiconductor precision cutting equipment, Tengsheng Precision Cutting and Sorting JIG SAW equipment is currently in a leading position in terms of technology: the fully automatic dual-station cutting and sorting all-in-one machine FDS3200, which took three years of research and development and will be the first to achieve mass production in 2022. It has highly independently developed and mastered independent core technologies such as cutting engines, high-speed visual sorting systems, and JIG SAW special ultra-high-speed motors. The equipment integrates functions such as automatic loading and unloading, dual-station cutting, and high-speed visual sorting, and is powerful. , complete configuration, can meet the cutting and sorting integrated needs of customers, and is more suitable for large-scale leading semiconductor packaging and testing companies.
Used for precision cutting of semiconductors
Fully automatic dual station sorting machine FDS3200
17 years of experience in visual motion control research and development, as well as rich experience in cutting engine development, make FDS3200 extremely competitive in the market. Its product performance is comparable to similar products in Japan and South Korea, with a UPH of 20.6K. As of the end of July 2023, Tengsheng Precision’s 12-inch Tape SAW sales reached 1,000+ units.
Tengsheng precision fully automatic dual-station sorting all-in-one machine
FDS3200 assembly workshop
At the exhibition, we also saw the fully automatic biaxial cutting machine ADS2100 and the automatic biaxial cutting machine SDS1210 exhibited by Tengsheng Precision, which can mainly meet the needs of customers in semiconductor front-end wafer dicing, finished products after packaging and testing, PCB, and EMC wires Cutting needs for frames, glass, ceramics, etc.
Shared by Director of Tengsheng Precision Week
"Semiconductor Precision Dispensing and Dicing Process Technology"
In addition to getting to know Tengsheng's precision equipment up close, Tengsheng also carefully prepared ten keynote speeches for this exhibition, so that the audience who came to the exhibition could feel its precision equipment and have a deeper understanding of Tengsheng. Precision’s cutting-edge technological achievements and product solutions in the fields of dispensing and cutting. The specific speech times are from the 11th to the 12th at 10:00 and 11:30 in the morning, 14:00 and 15:30 in the afternoon; on the 13th at 10:00 and 11:30, we look forward to everyone coming to sit down and chat.
Tengsheng Precision Booth 7B65 Keynote Speech Area
Leading the development of the industry with world-class quality, Tengsheng, founded in 2006, has been deeply involved in the fields of precision dispensing and precision cutting for 17 years. While completing import substitution, it is also actively exploring new technologies and trends. Up to now, Tengsheng has obtained more than 150 patents, established partnerships with more than 100 domestic and foreign leading companies, and built more than ten office and production bases around the world.
Tengsheng Precision Dongguan Intelligent Equipment Industrial Park
With the corporate mission of letting precision manufacturing change the world, Tengsheng is constantly moving forward to become a world-class precision equipment company that achieves customer success and creates value for customers. Let us look forward to the rise of this precision equipment brand in China!
Tensun was founded in July 2006 and has been focusing
on
Precision dispensing and precision cutting (dicing) two product lines,
Deeply engaged in the three major industries of 3C mobile phone industry chain, new display and semiconductor packaging and testing.
Since its establishment,
Tensun
has attached great importance to R&D investment in core technologies.
At present, we have mastered the core technologies of precision dispensing and precision cutting (dicing).
Become a company with core module design, complete machine and automation system integration capabilities
High-tech precision equipment enterprise.
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