See you tomorrow, the cyborg carnival is finally here!

Latest update time：2022-11-07 17:20

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From November 6th to 8th, chip + packaging and testing + embedded system exhibition, one-stop selection of localized components - 2022 ELEXCON Shenzhen International Electronics Show and Embedded System Exhibition, the 6th SiP System-level Packaging Conference The cum exhibition is coming!

This year, Xin Shiye continues to work with the ELEXCON Electronics Show to launch a special theme exhibition area - "Xin Shiye IC Design Zone" , [Booth number: Shenzhen Convention and Exhibition Center (Futian) Hall 1, 1X11 ] , adding more heat to this carnival feast of electronics!

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Xinshiye IC Design Zone

This "Xinshiye IC Design Zone" is located at 1X11, Hall 1, Shenzhen Convention and Exhibition Center (Futian). By then, more than ten semiconductor-related companies including Wuhan Xinyuan, Diao Micro, Xinxiang Semiconductor, Han Tianxia, Shuming Semiconductor, Zhixin Company, Changgong Micro, China Micro Aixin, Foxconn Testing Innovation Center, etc. will make their debut here. Display cutting-edge technology new products and innovative research and development results.

Here, you can have in-depth interactions with corporate executives, technical experts, original engineers, purchasing managers, and industry figures to chat about technology, seek business opportunities, seek cooperation, expand markets, and witness new products, new models, and new business formats in the electronics industry. . Welcome all industry elites to attend the exhibition!

In addition, Xin Shiye will hold an "E-Forward" series of interviews at the same time, and will have face-to-face exchanges with dozens of chip companies in the form of "exclusive live broadcast room exchanges + exhibition audience exchanges", revealing the company's development trends, innovative technologies and future plans, and talking about topics such as the development prospects of the semiconductor industry, market feedback, changes in supply and demand, investment and financing environment, and exploring new trends in the global semiconductor industry chain!

(We are here!)

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Four core theme exhibitions + nearly 20 forum meetings

The 2022 ELEXCON exhibition will focus on four core exhibition themes: "Automotive-grade chips and components", "Embedded and AIoT", "SiP and advanced packaging and testing", and "Selection of domestic components" , presenting a feast of the entire industry chain from components, chips to systems, from design, manufacturing to packaging and testing.

"Car-grade chips and components"

More than 200 exhibitors gathered together to showcase four major categories of products: automotive-grade MCU/smart car SoC, power devices/third-generation semiconductors/power management chips, automotive-grade components (connectors/protection devices/capacitors, resistors, etc.), and 5G RF and wireless communication modules/sensors, to alleviate the pain of "chip shortage" in the market!

"Embedded and AIoT"

From the data center to the device side, edge computing gives the system new potential, and AIoT outlines a new blueprint for embedded intelligent applications!

"SiP and Advanced Packaging and Testing"

In the post-Moore's Law era, the revolution in chip design methodology extends from the front-end to the back-end packaging and testing, breaking through the PPA challenge limit!

"Domestic component selection"

Thanks to the demand driven by 5G, AI, smart cars and data centers, and at the same time, under the dilemma of "China Chip" encountering a blockade, many subdivided tracks of China's semiconductors have attracted attention, and the future market potential is huge!