Toshiba's new silicon carbide power module technology improves reliability while reducing size
Click "Toshiba Semiconductor" and join us now!
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) recently announced that it has developed packaging technology for silicon carbide (SiC) power modules that can double product reliability [1] while reducing package size by 20% [2] .
Compared with silicon, silicon carbide can achieve higher voltage and lower loss, and is widely regarded as a new generation of materials for power devices. Although it is currently mainly used in inverters for trains, it will soon be widely used in high-voltage applications such as photovoltaic power generation systems and automotive equipment.
Reliability is the main issue that limits the use of silicon carbide devices. The application in high-voltage power modules requires not only semiconductor chips, but also the package itself must have high reliability. Toshiba uses a new silver (Ag) sintering technology for chip welding to effectively improve the reliability of the package.
In current silicon carbide packages, increased power density and switching frequency will lead to degradation of soldering performance, making it difficult to suppress the increase in on-resistance over time in the chip. Silver sintering technology can significantly reduce this degradation. The thermal resistance of the silver sintering layer is only half that of the soldering layer, allowing the chips in the module to be closer together and reduce the size.
Toshiba has named this new technology iXPLV and will apply it to the mass production of 3.3kV-class SiC power modules from the end of this month. Details of the technology were presented at the international power semiconductor conference PCIM Europe held online on May 5.
New package for SiC power modules (iXPLV)
Improved reliability through silver sintering technology [3]
[1] Toshiba defines reliability as the length of time before a 5% voltage change occurs during a power cycling test, a widely recognized semiconductor reliability test. For silver sintered modules, this time is approximately twice that of Toshiba’s soldered modules.
[2] The new package measures 140mm x 100mm, 23% smaller than Toshiba’s current package of 140mm x 130mm.
[3] The X-axis in the graph is the relative number of cycles between on and off settings. Power cycling tests evaluate the degradation of semiconductors after multiple cycles. Toshiba defines the number of cycles that results in a 5% voltage change on the soldered module as “1”.
*Company names, product names, and service names mentioned herein may be trademarks of their respective companies.
*The product prices and specifications, service content and contact information in this document are the latest information on the date of announcement, but are subject to change without prior notice.
About Toshiba Electronic Devices & Storage Corporation
Toshiba Electronic Devices & Storage Corporation combines the vigor of a new company with the wisdom of experience. Since becoming an independent company in July 2017, it has taken its place among the leading general device companies, offering customers and partners outstanding solutions in discrete semiconductors, system LSI and HDD.
The company's 24,000 employees around the world are committed to maximizing the value of their products. Toshiba Electronic Devices & Storage Corporation places great emphasis on close collaboration with customers to promote co-creation of value and jointly develop new markets, achieving annual sales of more than 750 billion yen (US$6.8 billion). The company looks forward to building a better future for people everywhere.
For more information about Toshiba Electronic Devices & Storage Corporation, please visit: https://toshiba-semicon-storage.com
Featured Posts
京公网安备 11010802033920号