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STM32
There is an Easter egg at the end of the article
Core-MP157A industrial-grade core board is based on the STM32MP157A series of high-performance microprocessors and integrates CPU, DDR3, EMMC/Nand Flash, PMIC, Ethernet PHY and WiFi modules. The core board uses a 204pin DDR3 gold-plated gold finger interface to maximize simplicity. User product design, flexible carrier board design adjustment.
Core-MP157A core board features:
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Highly integrated industrial-grade core board with onboard PHY and WiFi modules, simplifying user carrier board design to the greatest extent;
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Materials used by the industry’s top brands are subject to rigorous high and low temperature and pressure testing to ensure excellent quality;
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DDR3 gold finger packaging is suitable for mass production by enterprise users, and is convenient for production assembly and plug-in maintenance.
The STM32MP157A series of high-performance microprocessors are equipped with a dedicated 3D graphics processing unit (GPU), which integrates a large number of peripheral interfaces, such as audio, camera, dual USB, UART, LCD, SDIO and other interfaces. It integrates high-performance audio and Image processing technology also meets industrial field control requirements. It can meet the needs of rich graphics and high response in consumer electronics, industrial, and medical scenarios.
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The front of the Core-MP157A core board
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Core-MP157A series core board selection
The above is the naming information of the standard version of the Core-MP157 core board.
The Core-157 standard core board leads out most of the pin resources, and some pins have multiplexing functions. The reuse needs to be considered during design. Please establish communication with technical support. The main parameters of the hardware resources are as shown in the table:
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Core-MP157A core board key parameter table
Electrical and performance parameters
System main performance and configuration
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System frequency
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Configuration parameters
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Communication interface parameters
While ensuring the reliability and integrity of the PCBA design, the testing department also uses stress stress testing tools and iperf3 network testing tools to conduct further stress testing on the CPU, memory, EMMC and network ports to ensure industrial-grade quality products.
Test conclusion
: When the CPU utilization rate almost reached 100%, there was no memory leak, abnormal CPU load, system crash, etc.; the EMMC disk was subjected to write and erase stress tests, and there were no disk mount failures, disk read and write abnormalities, etc.; the network port tested bandwidth quality, delay jitter and packet loss in TCP and UDP modes, and network storm tests, and the signal quality and communication were normal.
Environmental parameters
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Working environment
Many consumer electronics, industrial, and medical application scenarios are very demanding. There are many application scenarios and the product's working environment is changeable. The consistency under high/low temperatures is the guarantee of product stability. The Core-MP157A core board passed the test in accordance with the low-temperature test method of GB/T2423.1-2008 (IEC60068-2-1:2007) and the high-temperature test method of GB/T2423.2-2008 (IEC60068-2-2:2007).
Electrical parameters
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Static electrical parameters
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Power consumption test
The Core-MP157 core board was turned on and off 2300 times continuously. The memory on the core board was not damaged, it could be powered on and started normally, and the functional test was normal. Through the analysis and statistics of test records, we can lock the power consumption while ensuring the stability of the system.
Mechanical Dimensions
The dimensional drawing of the Core-MP157A core board is as follows. The compact size is convenient for miniaturization or handheld device design. The DDR3 golden finger package is convenient for installation and plugging. In the case of strong vibration, just tighten the two screw positioning holes on the top of the core board for reinforcement. The low-power design does not require the use of heat sinks and other measures.
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Mechanical dimensions
CD data
Wangwang Electronics provides complete CD-ROM information, including data manuals, hardware design reference drawings and AD packaging libraries, software source codes and demo routines, factory firmware and test reports, etc.
The user manual has detailed descriptions of environment setup, firmware updates, and functional testing, making it easy for users to get started quickly. Based on recommended baseboard drawings and packaging, hardware engineers can quickly launch prototypes.
SDK
Wangwang Electronics provides a complete Linux BSP. The specific software resources are as shown in the table below. Enterprise-level users can choose to have our company perform SDK maintenance on your project and complete the driver transplantation and tailoring work.
The user's R&D team focuses on its product application development and logic implementation, each utilizing its strengths and working together to reduce project R&D investment and accelerate product launch and iteration. For this reason, we also provide an Ubuntu virtual machine environment equipped with a cross-compiler for user application compilation.
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EVM-MP157 evaluation board software resource table
STM32MP157 evaluation board/development board
In order to verify and use the powerful functions of STM32MP157, in addition to launching the Core-MP157A industrial-grade core board, our company also provides the corresponding evaluation kit EVM-MP157 for users to quickly develop and verify performance and interfaces.
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Front view of EVM-MP157 evaluation board
At the same time, a combination set of 7-inch MIPI kits is also provided, which does not require complex environment construction or wiring connections. Equipped with "ETest software", the single board can be used out of the box.
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EVM-MP157 evaluation board kit with screen
The interface resource testing and use of the evaluation board can be tested in the software or controlled by referring to the user manual.
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EVM-MP157 evaluation board interface resources
Evaluation Board Mechanical Dimensions
The dimensions of the EVM-MP157 development board are as follows, and the corresponding baseboard design files and packages can be obtained from the CD-ROM.
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Mechanical dimensions of EVM-MP157 evaluation board
The Core-157 industrial-grade core board integrates PMIC, LPDDR4, EMMC, 2-way Gigabit PHY, etc., and uses a 204pin golden finger interface.
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Core-MP157A core board functional block diagram
Purchase link (copy the link to Taobao to open):
https://talowe.taobao.com/category-1678432928.htm?spm=a1z10.1-cs.w4010-22498409553.17.3f8a18c3MDauUd&search=y&parentCatId=1678432924&parentCatName=%C6%BD% CC %A8&catName=ST#bd
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Congratulations to [A Little Night Breeze] for winning the first issue of the Heartfelt Message Award FS-MP1A Development Board
Congratulations to [Lucifer] for winning the second heartfelt message award MYD-YA15XC-T development board
Congratulations to [Emma zhuang] for winning the third issue of the Heartfelt Message Award for the Wildfire STM32MP157 pro development board
Congratulations to [Wu Xue] for winning the fourth issue of the Heartfelt Message Award for the MYZR-ST32MP15-EK152 development board
Congratulations to [Mr.Qin] for winning the fifth issue of the Heartfelt Message Award for the Punctual Atomic STM32MP157 development board
Congratulations to [zbc] for winning the sixth issue of the Heartfelt Message Award for the PanGu Development Board
Congratulations to [abner] for winning the seventh issue of the Heartfelt Message Award Lierda STM32MP1 Development Board
Congratulations to [BluefinTuna] for winning the 8th issue of Heartfelt Message Award PHYTEC Development Board
Congratulations to [Dream Chasing], [MR.White], and [BigC++] for winning the ninth issue of the Heartfelt Message Award DongshanPI-7 Linux Development Board
Congratulations to [Peng] for winning the 10th issue of the heartfelt message award. Xunwei STM32MP157 development board
Congratulations to [ᛈᛁᚳᚩᛋᛈᚢᚳᚻ] for winning the 11th issue of Heartfelt Message Award BearPi-HM Micro Development Board
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